Abstract:This article deals with the design of on-chip architectures for testing large system chips (SOCs) for manufacturing defects in a modular fashion. These architectures consist of wrappers and test access mechanisms (TAMs). For an SOC with specified parameters of modules and their tests, we design an architecture that minimizes the required tester vector memory depth and test application time. In this article, we formulate the test architecture design problems for both modules with fixed- and flexible-length scan chains, assuming the relevant module parameters and a maximal SOC TAM width are given. Subsequently, we derive a formulation for an architecture-independent lower bound for the SOC test time. We analyze three types of TAM under-utilization that make the theoretical lower bound unachievable in most practical architecture instances. We present a novel architecture-independent heuristic algorithm that effectively optimizes the test architecture for a given SOC. The algorithm efficiently determines the number of TAMs and their widths, the assignment of modules to TAMs, and the wrapper design per module. We show how this algorithm can be used for optimizing both test bus and TestRail architectures with either serial or parallel test schedules. Experimental results for the ITC'02 SOC Test Benchmarks show that, compared to manual best-effort engineering approaches, we can save up to 75% in test times, while compared to previously published algorithms, we obtain comparable or better test times at negligible compute time.

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

A Test Architecture for Test Reuse in SOC Design

Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing

Scheduling Tests for 3D Stacked Chips under Power Constraints

SOC test architecture design for efficient utilization of test bandwidth

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

New Dft Architectures for 3D-Sics with A Wireless Test Port

An Optimization Algorithm for Pre-Bond TSV Probing Tests and Fault Localization

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

Three Dimensional ICs Thermal-Driven Test Application Scheme

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

A 3D Integration Testing Vehicle with TSV Interconnects

Session-Less Test Scheduling for Multi-Tower 3D-Sics

A Test Scheduling Method for Multi-Tower 3D-SIC Based on Quantum-Behaved Particle Swarm Optimization Algorithm

Improve Test Compression Ratio and Reduce Test Power of EFDR Codes by Scan Chain Reconfiguration

Memory Grouping for the Built-In Self-Test of Three-Dimensional Integrated Circuits