Abstract:Three-dimensional integrated circuits (3-D ICs), i.e., stacked dies, can alleviate the interconnect problem coining with the decreasing feature size and increasing integration density, and promise a solution to heterogenous integration. The vertical connection, which is generally implemented by the through-the-si I icon via, is a key technology for 3-D ICs. In this paper, given 3-D circuit placement or floorplan results with white space reserved between blocks for inter-layer interconnections, we proposed methods for assigning inter-layer signal via locations. Introducing a grid structure on the chip, the inter-layer via assignment of two-layer chips can be optimally solved by a convex-cost max-flow formulation with signal via congestion optimized. As for 3-D ICs with three or more layers, the inter-layer signal via assignment is modeled as an integral min-cost multi-commodity flow problem, which is solved by a heuristic method based on the lagrangian relaxation. Relaxing the capacity constraints in the grids, we transfer the min-cost multi-commodity flow problem to a sequence of lagrangian sub-problems, which are solved by finding a sequence of shortest paths. The complexity of solving a lagrangian sub-problem is O(n(nt)n(g)(2)), where n(nt) is the number of nets and n(g) is the number of grids on one chip layer. The experimental results demonstrated the effectiveness of the method.

Through-Silicon-Via Assignment for 3D ICs

Integrated Algorithm for 3-D IC Through-Silicon Via Assignment

Sensitivity analysis of through-silicon via (TSV) interconnects for 3-D ICs

Through-silicon-via technology for 3D integration

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

System-Level Analysis of 3D ICs with Thermal TSVs

A Rigorous Model for Through-Silicon Vias with Ohmic Contact in Silicon Interposer

Lagrangian relaxation based pin assignment and Through-Silicon Via planning for 3-D SoCs

On Effective Through-Silicon Via Repair for 3-D-stacked ICs

A 3D Integration Testing Vehicle with TSV Interconnects

Lagrangian Relaxation Based Inter-Layer Signal Via Assignment For 3-D Ics

Integrated Interlayer Via Planning And Pin Assignment For 3d Ics

Signal Through-the-silicon Via Planning and Pin Assignment for Thermal and Wire Length Optimization in 3D ICs

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Whitespace insertion for through-silicon via planning on 3-D SoCs

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

High Aspect Ratio Copper Through-Silicon-vias for 3D Integration

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review