Abstract:Three-dimensional (3D) integrated circuit (IC) is regarded as an important way for the enhancement on the performance and integration density of IC to cope with the challenge of "the ending of the Moore's law".The 3D IC is suitable for the high density or heterogenous integration applications for its multi-layer stacked structure.Memory is one of the important applications of 3D integration technology for it is a typical high density product.3D memory,which increases memory density and bandwidth of memory access path simultaneously,is a promising solution of the "memory wall problem".With the scaling down of memory devices,the amount of faulty cells in memory array increases rapidly,it gives rise to the requirement of the build in self-repair (BISR) technique for acceptable memory reliability.The through silicon vias (TSVs),which works as the vertical signal paths in 3D memory,enable the inter-die sharing techniques of redundant resources for higher utilization ratio.This work proposes a sharing strategy of adjacent redundant cells across dies for better repair capability.This strategy is deadlock free,and it has good utility of redundant resources and relatively small area overhead of through silicon vias (TSVs).Simulation results show that,comparing with the published die-pair sharing strategy,the proposed strategy obtains higher repair rate.Furthermore,the proposed BISR has no obvious drop of repair rate with respect to the increase of the layer count,implying a good applicability in the large scale 3D memories.

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Simultaneous Buffer and Interlayer Via Planning for 3D Floorplanning

LP Based White Space Redistribution for Thermal Via Planning and Performance Optimization in 3D ICs

Buffer Planning for 3D ICs.

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

High Aspect Ratio Copper Through-Silicon-vias for 3D Integration

PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon

Via assignment algorithm for hierarchical 3-D placement

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

Low-loss Through Silicon Vias (tsvs) and Transmission Lines for 3D Optoelectronic Integration

A BISR Scheme for 3D Stacked Memory by Sharing Adjacent Redundancy Cells Across Dies

High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards

A Low-Latency and Low-Power Hybrid Insertion Methodology for Global Interconnects in VDSM Designs

Double-Shielded Interposer with Highly Doped Layers for High-Speed Signal Propagation

Lateral Asynchronous and Vertical Synchronous 3D Network on Chip with Double Pumped Vertical Links.

3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs

3-D placement algorithm with vertical via count constraints

A Timing-driven Analytical Placer for Gate-Level Partitioned Monolithic 3D ICs

Interconnect Delay Optimization Using a Novel Hybrid Insertion Strategy

Congestion Driven Placement for Three Dimensional Integration Chip Design Using Uniformity Modeling Approach