Abstract:Interconnect delay is a key factor that affects the chip performance in layer assignment. Particularly in the advanced process technologies of 5 nm and beyond, interconnect delay has grown significantly due to the increase of circuit scale. Moreover, coupling effect existed in wires reduces the accuracy of delay evaluation. On the other hand, the size of vias is often ignored in layer assignment, which enlarges the mismatch between global routing and detailed routing. To solve these problems, we propose VPT, a timing-aware layer assignment algorithm considering via pillars, which includes the following five key techniques: 1) via pillar structure combined with nondefault-rule (NDR) wires is adopted to form a net delay optimization system for advanced process technologies; 2) a synthetical model that can adapt to varying types and sizes of both vias and wires is designed to evaluate overflow effectively; 3) a sorting strategy is devised to reduce uncertainty of layer assignment flow and improve stability of the proposed algorithm; 4) an awareness strategy based on multiaspect congestion assessment is designed to reduce overflow significantly; and 5) a net scalpel algorithm is devised to minimize the maximum delay of nets, so that the timing behaviors can be improved systematically. The experimental results on multiple benchmarks confirm that the proposed algorithm leads to lower delay and less overflow, while achieving the best solution quality among the existing algorithms with the shortest runtime.

Integrated Interlayer Via Planning And Pin Assignment For 3d Ics

Simultaneous Buffer and Interlayer Via Planning for 3D Floorplanning

Signal Through-the-silicon Via Planning and Pin Assignment for Thermal and Wire Length Optimization in 3D ICs

Integrated Algorithm for 3-D IC Through-Silicon Via Assignment

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Buffer Planning for 3D ICs.

Chip Layer Assignment Method for Analytical Placement of 3D ICs

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

Via assignment algorithm for hierarchical 3-D placement

A thermal-driven force-directed floorplanning algorithm for 3D ICs

3-D placement algorithm with vertical via count constraints

Through-Silicon-Via Assignment for 3D ICs

Congestion Driven Placement for Three Dimensional Integration Chip Design Using Uniformity Modeling Approach

A Multilevel Analytical Placement for 3D ICs

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

Effective Analytical Placement for Advanced Face-to-Face-Bonded Circuit Designs.

O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs

Timing-Aware Layer Assignment for Advanced Process Technologies Considering Via Pillars

3D architecture modeling and exploration