Abstract:Vertical integration (3D ICs) has demonstrated the potential to reduce inter-block wire latency through flexible block placement and routing. However, there is an untapped potential for 3D ICs to reduce intra-block wire latency through architectural designs that can leverage multiple silicon layers in innovative ways. Furthermore, it is particularly challenging to simultaneously explore the physical design space and microarchitectural space for vertical integration. The physical design space typically has no information on the microarchitectural impact of latency optimization, and the microarchitectural space has no information on the physical design impact of different architectural alternatives. We make the following contributions in this paper: (1) the introduction of port partitioning, a new approach to constructing multi-layer blocks; (2) the extension of a microarchitectural exploration tool to include the ability to model multilayer blocks and to consider these blocks as alternative implementations of single-layer architectural blocks on the fly, within a single floorplanning run; and (3) the evaluation of vertical integration on a design driver using this framework. For this design driver, we see an average 36% improvement in performance (measured in BIPS) over a single-layer architecture, and a 29% improvement in performance over a multi-layer architecture with single-layer blocks. The on-chip temperature is kept below 40°C.

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

Bipartition for 2.5-D floorplanning based on corner block list representation

A Parallel Vlsi Floorplanning Algorithm Using Corner Block List Topological Representation

Floorplanning For 2.5-D System Integration Using Multi-Layer-Bsg Structure

A thermal-driven force-directed floorplanning algorithm for 3D ICs

Multi-Objective Optimization in 3D Floorplanning

A Criticality-Driven Microarchitectural Three Dimensional (3D) Floorplanner

Integrated Interlayer Via Planning And Pin Assignment For 3d Ics

A Floorplanning Algorithm for Novel Three-Dimensional Nano Integrated Circuits

Simultaneous Buffer and Interlayer Via Planning for 3D Floorplanning

System partitioning on MCM using a new neural network model

Hierarchical 3-D Floorplanning Algorithm for Wirelength Optimization.

Performance constrained floorplanning based on partial clustering [IC layout]

3D architecture modeling and exploration

Floorplanning for 2.5-D Integration

A Non-Slicing Floorplanning Algorithm Using Corner Block List Topological Representation

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Corner block list representation and its application with boundary constraints

Vlsi Floorplanning with Boundary Constraints Using Corner Block List Representation

VLSI Floorplanning with Boundary Constraints Based on Corner Block List

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.