Abstract:Vertical integration (3D ICs) has demonstrated the potential to reduce inter-block wire latency through flexible block placement and routing. However, there is an untapped potential for 3D ICs to reduce intra-block wire latency through architectural designs that can leverage multiple silicon layers in innovative ways. Furthermore, it is particularly challenging to simultaneously explore the physical design space and microarchitectural space for vertical integration. The physical design space typically has no information on the microarchitectural impact of latency optimization, and the microarchitectural space has no information on the physical design impact of different architectural alternatives. We make the following contributions in this paper: (1) the introduction of port partitioning, a new approach to constructing multi-layer blocks; (2) the extension of a microarchitectural exploration tool to include the ability to model multilayer blocks and to consider these blocks as alternative implementations of single-layer architectural blocks on the fly, within a single floorplanning run; and (3) the evaluation of vertical integration on a design driver using this framework. For this design driver, we see an average 36% improvement in performance (measured in BIPS) over a single-layer architecture, and a 29% improvement in performance over a multi-layer architecture with single-layer blocks. The on-chip temperature is kept below 40°C.

Floorplanning For 2.5-D System Integration Using Multi-Layer-Bsg Structure

Floorplanning for 2.5-D Integration

Bipartition for 2.5-D floorplanning based on corner block list representation

Multi-Objective Optimization in 3D Floorplanning

Combining the Ant System Algorithm and Simulated Annealing for 3d/2d Fixed-Outline Floorplanning

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

TSVs-aware floorplanning for 3D integrated circuit

An Automatic 2.5-D Layout Design Flow

Multi-Layer Floorplanning for Stacked Ics: Configuration Number and Fixed-Outline Constraints

Design of Floorplanning Algorithm in Three-Dimension Integrated Circuit Based on Thermal and Utilization

3D architecture modeling and exploration

Hybrid Algorithm for Floorplanning Using B*-tree Representation

A thermal-driven force-directed floorplanning algorithm for 3D ICs

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

Floorplanning of VLSI by Mixed-Variable Optimization

Simultaneous Allocation and Floorplan Algorithm

Ant system based 3D fixed-outline floor planning

Cubic Packing with Various Candidates for 3D IC Design

Simultaneous Buffer and Interlayer Via Planning for 3D Floorplanning

A Parallel Vlsi Floorplanning Algorithm Using Corner Block List Topological Representation

Effective Analytical Placement for Advanced Face-to-Face-Bonded Circuit Designs.