Abstract:Vertical integration (3D ICs) has demonstrated the potential to reduce inter-block wire latency through flexible block placement and routing. However, there is an untapped potential for 3D ICs to reduce intra-block wire latency through architectural designs that can leverage multiple silicon layers in innovative ways. Furthermore, it is particularly challenging to simultaneously explore the physical design space and microarchitectural space for vertical integration. The physical design space typically has no information on the microarchitectural impact of latency optimization, and the microarchitectural space has no information on the physical design impact of different architectural alternatives. We make the following contributions in this paper: (1) the introduction of port partitioning, a new approach to constructing multi-layer blocks; (2) the extension of a microarchitectural exploration tool to include the ability to model multilayer blocks and to consider these blocks as alternative implementations of single-layer architectural blocks on the fly, within a single floorplanning run; and (3) the evaluation of vertical integration on a design driver using this framework. For this design driver, we see an average 36% improvement in performance (measured in BIPS) over a single-layer architecture, and a 29% improvement in performance over a multi-layer architecture with single-layer blocks. The on-chip temperature is kept below 40°C.

Bipartition for 2.5-D floorplanning based on corner block list representation

Floorplanning For 2.5-D System Integration Using Multi-Layer-Bsg Structure

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

Floorplanning for 2.5-D Integration

Physical Design of the "2.5D" Stacked System

A Parallel Vlsi Floorplanning Algorithm Using Corner Block List Topological Representation

Corner block list representation and its application with boundary constraints

VLSI Floorplanning with Boundary Constraints Based on Corner Block List

Vlsi Floorplanning with Boundary Constraints Using Corner Block List Representation

A Non-Slicing Floorplanning Algorithm Using Corner Block List Topological Representation

A Feasibility Study of 2.5d System Integration

2.5-Dimensional VLSI System Integration

Rectangle-packing-based Floorplanning Algorithms for System-on-a-chip Design

General Floorplans with L/T-shaped Blocks Using Corner Block List

A Criticality-Driven Microarchitectural Three Dimensional (3D) Floorplanner

Interconnect characteristics of 2.5-D system integration scheme.

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

Cubic Packing with Various Candidates for 3D IC Design

3D architecture modeling and exploration

Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration.

Corner Block List Representation and Its Application to Floorplan Optimization