Abstract:3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental processing steps will be described, as well as appropriate handling concepts. Three main concepts for 3D integration have been developed at IZM. The approach with the greatest flexibility called Inter Chip Via - Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences before joining them to integrated stacks.

A Feasibility Study of 2.5d System Integration

Physical Design of the "2.5D" Stacked System

2.5-Dimensional VLSI System Integration

Interconnect characteristics of 2.5-D system integration scheme.

Bipartition for 2.5-D floorplanning based on corner block list representation

Placement For 2.5-D Integration

A Road Map Of 2.5-D Integration

A Cost Comparison of Vlsi Integration Schemes

Floorplanning for 2.5-D Integration

Multi-Chip 3D Integrated Micro-System Based on Microwave Multilayer

Floorplanning For 2.5-D System Integration Using Multi-Layer-Bsg Structure

Study On Electrical Performance Of Stacking Die Package With Silicon Interposer

Two-dimensional and three-dimensional integration of heterogeneous electronic systems under cost, performance, and technological constraints

Study on Opto-Mechatronic Hybrid Integration Technology Based on 2.5D Advanced Packaging

Single Level Integrated Packaging Modules For High Performance Electronic Systems

Technologies for 3D Heterogeneous Integration

An Automatic 2.5-D Layout Design Flow

A 3D Integration Testing Vehicle with TSV Interconnects

Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration.

Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via.

3D Chip Stack Technology Using Through-Chip Interconnects