A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration
Jie Liao,Bo Jiao,Jinshan Zhang,Shiwei Liu,Hao Jiang,Jun Tao,Wenning Jiang,Qi Liu,Lihua Zhang,Haozhe Zhu,Chixiao Chen
DOI: https://doi.org/10.1109/iscas46773.2023.10181990
2023-01-01
Abstract:Chiplet is a critical technology in the post-Moore era, and the die-to-die (D2D) interconnect is essential for communication between chiplets. Meanwhile, several edge-computing devices based on 2.5D/3D chiplet have recently emerged. However, a lightweight D2D interconnect for 2.5D/3D edge-computing systems is lacking. Given the differences between 2.5D/3D integration, a scalable D2D interconnect with replay and repair schemes is presented in this paper. A credit-based flow control scheme and a custom replay scheme are presented for high efficiency. An effective detection and repair scheme is proposed to enhance fault tolerance for the D2D interconnect. Compared with a previous D2D interconnect design, the proposed D2D interconnect delivers 1.07/1.09Gbps throughput ( $\sim 2.4\times/\sim 3.9\times \text{for}\ \text{write}/\text{read}$ ) and significantly reduced energy/bit with only ∼1.7× increased hardware cost. Additionally, compared with a previous chip-to-chip interconnect design, the proposed D2D interconnect can be configured down to power consumption as low as 0.55pJ/bit and 38.40Gbps throughput, achieving ∼2.5× throughput and significantly reduced latency with a negligible increase in hardware cost.