Abstract:The resource constraints and accuracy requirements for Internet of Things (IoT) memory chips need three-dimensional (3D) monolithic integrated circuits, of which the increasing stack layers (currently more than 176) also cause excessive energy consumption and increasing wire length. In this paper, a novel 3D wireless network on chips (3DWiNoCs) model transmitting signal directly to the destination in arbitrary layer is proposed and characterized. However, due to the the reflection and refraction characteristics in each layer, the complex and diverse wireless paths in 3DWiNoC add great difficulty to the channel characterization. To facilitate the modeling in massive layer NoC situation, both boundary-less model boundary-constrained 3DWiNoC model are proposed, of which the channel gain can be obtained by a computational efficient approximate algorithm. These 3DWiNoC models with approximation algorithm can well characterize the 3DWiNoC channel in aspect of complete reflection and refraction characteristics, and avoid massive wired connections, high power consumption of cross-layer communication and high-complexity of 3DWiNoC channel characterization. Numerical results show that: 1) The difference rate between the two models is lower than 0.001% (signal transmit through 20 layers); 2) the channel gain decreases sharply if refract time increases; and 3) the approximate algorithm can achieve an acceptable accuracy (error rate lower than 0.1%).

Dual-link interconnect architecture for 3-D Mesh-based network on chip

Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip

Design of 3D NoC Network Architecture

A Dual-Port Access Structure of 3D Mesh-Based NoC

Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs

Dual-Channel Access Mechanism for Cost-Effective NoC Design

Lateral Asynchronous and Vertical Synchronous 3D Network on Chip with Double Pumped Vertical Links.

An Inductive-Coupling Interconnected Application-Specific 3D NoC Design.

Advanced RF/baseband Interconnect Schemes for Inter- and Intra-Ulsi Communications

A hybird hierarchical architecture for 3D multi-cluster NoC

An Efficient and Low-Overhead Chip-to-Chip Interconnect Protocol Design for NOC

A Low-Cost and High-Throughput NoC-Aware Chip-to-Chip Interconnection

A Tightly Coupled Network-on-Chip Router Architecture

A Reconfigurable 2D-Mesh NoC Design with Agile Development Technique of SpinalHDL

Performance and power consumption analysis of memory efficient 3D network-on-chip architecture

Cost-driven 3D Integration with Interconnect Layers

System Level Interconnect Design for Network-on-chip Using Interconnect IPs.

Low Latency Multicasting Scheme for Bufferless Hybrid NoC-Bus 3D On-Chip Networks

System-level optimization of Network-on-Chips for heterogeneous 3D System-on-Chips

3D Wireless Channel Modeling for Multi-layer Network on Chip

Performance Evaluation of Torus and Mesh in 3D Network-on-chip