Abstract:Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and high-bandwidth fabric for interconnect design. The advent of the 3D technology has provided further opportunity to reduce on-chip communication delay. However, the design of the 3D NoC topologies has important distinctions from 2D NoCs or off-chip interconnection networks. First, current 3D stacking technology allows only vertical inter-layer links. Hence, there cannot be direct connections between arbitrary nodes in different layers — the vertical connection topology are essentially fixed. Second, the 3D NoC is highly constrained by the complexity and power of routers and links. Hence, low-radix routers are preferred over high-radix routers for lower power and better heat dissipation. This implies long network latency due to high hop counts in network paths. In this paper, we design a low-diameter 3D network using low-radix routers. Our topology leverages long wires to connect remote intra-layer nodes. We take advantage of the start-of-the-art one-hop vertical communication design and utilize lateral long wires to shorten network paths. Effectively, we implement a small-to-medium sized clique network in different layers of a 3D chip. The resulting topology generates a diameter of 3-hop only network, using routers of the same radix as 3D mesh routers. The proposed network shows up to 29% of network latency reduction, up to 10% throughput improvement, and up to 24% energy reduction, when compared to a 3D mesh network.

An Inductive-Coupling Interconnected Application-Specific 3D NoC Design.

Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs

Inverse Design of On-Chip Interconnect via Transfer Learning-Based Deep Neural Networks

Dual-link interconnect architecture for 3-D Mesh-based network on chip

A High-Level Exploration Tool for Three-Dimensional Network-on-chip

Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip

A hybrid vertical interconnect for three-dimensional network-on-chip

Lateral Asynchronous and Vertical Synchronous 3D Network on Chip with Double Pumped Vertical Links.

A Survey on Architecture for Three-Dimensional Networks-on-Chip

Cost-driven 3D Integration with Interconnect Layers

A novel 3D NoC architecture based on De Bruijn graph

A Low-Radix and Low-Diameter 3d Interconnection Network Design

On-chip Multilayer Inductor Design in Near-Field Wireless Connection for 3D-System Integration

Hybrid Wired/Wireless On-Chip Network Design for Application-Specific SoC

Floorplanning Driven Network-on-Chip Synthesis for 3-D SoCs.

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Topology-aware Floorplanning for 3D Application-Specific Network-on-Chip Synthesis.

TSF3D: MSV-Driven Power Optimization for Application-Specific 3D Network-on-Chip

Design of 3D NoC Network Architecture

System-level optimization of Network-on-Chips for heterogeneous 3D System-on-Chips