Abstract:By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower latency. However, thermal dissipation is one of the most critical challenges for 3D-ICs where the heat cannot easily transfer through several layers of silicon. Consequently, the high-temperature area also confronts the reliability threat as the Mean Time to Failure (MTTF) decreases exponentially with the operating temperature. Apparently, 3D-NoCs must tackle this fundamental problem in order to be widely used. Therefore, in this work, we investigate the thermal distribution and reliability prediction of 3D-NoCs. We first present a new method to help simulate the temperature (both steady and transient) using traffics value from realistic and synthetic benchmarks and the power consumption from standard VLSI design flow. Then, based on the proposed method, we further predict the relative reliability between different parts of the network. Experimental results show that the method has an extremely fast execution time in comparison to the acceleration lifetime test. Furthermore, we compare the thermal behavior and reliability between Monolithic design and TSV-based TSV. We also explorer the ability to implement the thermal via a mechanism to help reduce the operating temperature.

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

Multicast-Based Testing and Thermal-Aware Test Scheduling for 3d Ics with A Stacked Network-On-Chip

Power-and thermal-aware mapping for NoC under latency constraint

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

System-Level Analysis of 3D ICs with Thermal TSVs

Three Dimensional ICs Thermal-Driven Test Application Scheme

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

Thermal-Aware Placement And Routing For 3d Optical Networks-On-Chips

Report on power, thermal and reliability prediction for 3D Networks-on-Chip

A New Unicast-Based Multicast Scheme for Network-on-Chip Router and Interconnect Testing

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Thermal-aware small-delay defect testing in integrated circuits

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

Rapid Generation of Thermal-Safe Test Schedules

Scheduling Tests for 3D Stacked Chips under Power Constraints

TTNNM: Thermal- and Traffic-Aware Neural Network Mapping on 3D-Noc-based Accelerator