Abstract:Dark silicon is the phenomenon that a fraction of many-core chip has to be turned off or run in a low-power state in order to maintain the safe chip temperature. System-level thermal management techniques normally map application on non-adjacent cores, while communication efficiency among these cores will be oppositely affected over conventional network-on-chip (NoC). Recently, SMART NoC architecture is proposed, enabling single-cycle multi-hop bypass channels to be built between distant cores at runtime, to reduce communication latency. However, communication efficiency of SMART NoC will be diminished by communication contention, which will in turn decrease system performance. In this paper, we first propose an Integer-Linear Programming (ILP) model to properly address communication problem, which generates the optimal solutions with the consideration of inter-processor communication. We further present a novel heuristic algorithm for task mapping in dark silicon many-core systems, called TopoMap, on top of SMART architecture, which can effectively solve communication contention problem in polynomial time. With fine-grained consideration of chip thermal reliability and inter-processor communication, presented approaches are able to control the reconfigurability of NoC communication topology in task mapping and scheduling. Thermal-safe system is guaranteed by physically decentralized active cores, and communication overhead is reduced by the minimized communication contention and maximized bypass routing. Performance evaluation on PARSEC shows the applicability and effectiveness of the proposed techniques, which achieve on average 42.5 and 32.4 percent improvement in communication and application performance, and 32.3 percent reduction in system energy consumption, compared with state-of-the-art techniques. TopoMap only introduces 1.8 percent performance difference compared to ILP model and is more scalable to large-size NoCs.

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

Power-and thermal-aware mapping for NoC under latency constraint

Temperature-aware multi-application mapping on network-on-chip based many-core systems.

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

An SMDP-based approach to thermal-aware task scheduling in NoC-based MPSoC platforms

Thermal-Aware Task Mapping on Dynamically Reconfigurable Network-on-Chip Based Multiprocessor System-on-Chip

Temperature-Aware On-Chip Networks

Optimal Scheduling Algorithms of System Chip Power Density Based on Network on Chip

Algorithms for Temperature-Aware Task Scheduling in Microprocessor Systems

An Efficient Power-Aware Optimization for Task Scheduling on NoC-based Many-core System

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint

Thermal-aware application mapping using genetic and fuzzy logic techniques for minimizing temperature in three-dimensional network-on-chip

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

An Efficient Task Mapping Algorithm with Power-Aware Optimization for Network on Chip

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

Thermal-aware Resource Usage Allocation

HCGM-based High-Efficiency Temperature Evaluation Scheme for NoCs

A Two-Level Thermal Cycling-aware Task Mapping Technique for Reliability Management in Manycore Systems