Power-and thermal-aware mapping for NoC under latency constraint

DONG Wen-xiao,SHEN Hai-bin,QUAN Li,YAN Xiao-lang
DOI: https://doi.org/10.3969/j.issn.1007-0249.2012.05.006
2012-01-01
Abstract:As the number of components in Network-on-Chip(NoC) increases,power becomes a critical issue.Moreover,the scaling of MOS transistors increases the power density,which causes the temperature in high performance chip to rise dramatically.To deal with these,a power-and thermal-aware NoC mapping approach under latency constraint is proposed,which takes link power and static power into consideration.This approach is based on genetic algorithm,which encodes the chromosome as an array of integers,and uses irregular crossover and mutation operations.The results show that the proposed approach could reduce the peak temperature of chip by 3.9% than SGA,but only increase 0.3% in power consumption.
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