Abstract:The improvement of chip integration leads to the increase of power density of system chips, which leads to the overheating of system chips. When dispatching the power density of system chips, some working modules are selectively closed to avoid all modules on the chip being turned on at the same time and to solve the problem of overheating. Taking 2D grid-on-chip network as the research object, an optimal scheduling algorithm of system-on-chip power density based on network-on-chip (NoC) is proposed. Under the constraints of thermal design power (TDP) and system, dynamic programming algorithm is used to solve the optimal application set throughput allocation from bottom to top by dynamic programming for the number and frequency level of each application configuration processor under the given application set of network-on-chip. On this basis, the simulated annealing algorithm is used to complete the application mapping aiming at heat dissipation effect and communication delay. The open and closed processor layout is determined. After obtaining the layout results, the TDP is adjusted. The maximum TDP constraint is iteratively searched according to the feedback loop of the system over-hot spots, and the power density scheduling performance of the system chip is maximized under this constraint, so as to ensure the system core. At the same time, chip throughput can effectively solve the problem of chip overheating. The experimental results show that the proposed algorithm increases the system chip throughput by about 11%, improves the system throughput loss, and achieves a balance between the system chip power consumption and scheduling time.

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

Power-and thermal-aware mapping for NoC under latency constraint

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

HASO: A Hot-Page Aware Scheduling Optimization Method in Virtualized NUMA Systems

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip

Rapid Generation of Thermal-Safe Test Schedules

Multicast-Based Testing and Thermal-Aware Test Scheduling for 3d Ics with A Stacked Network-On-Chip

Optimal Scheduling Algorithms of System Chip Power Density Based on Network on Chip

Hierarchical SoC Testing Scheduling Based on the Ant Colony Algorithm

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

Incremental Sequence Pair Generation Algorithm for SOC Test Scheduling

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Scheduling Tests for 3D Stacked Chips under Power Constraints

Test Scheduling for IP Cores Optimization Based on the Genetic Algorithm

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

System-Level Analysis of 3D ICs with Thermal TSVs

A Test Scheduling Method for Multi-Tower 3D-SIC Based on Quantum-Behaved Particle Swarm Optimization Algorithm

A Shuffle Frog-Leaping Algorithm for Test Scheduling of 2D/3D SoC

Session-Less Test Scheduling for Multi-Tower 3D-Sics

A Novel Testability-Oriented Data Path Scheduling Scheme in High-Level Synthesis