Abstract:Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe thermal issues like temperature escalation, high thermal gradients, and excessive hot spot formation, which may result in degrading chip performance, accelerating device aging, and premature failure. Thermal-Aware Scheduling (TAS) enables optimization of thermal dissipation to maintain a safe thermal state. In this work, we implement a new TAS algorithm, POD-TAS, which manages the thermal behavior of a multi-core CPU based on a defined set of states and their transitions. We compare the performances of a dynamic RC thermal circuit simulator (HotSpot) and a reduced order Proper Orthogonal Decomposition (POD)-based thermal model and we select the latter for use in our POD-TAS algorithm. We implement a novel simulation-based evaluation methodology to compare TAS algorithms. This methodology is used to evaluate the performance of the proposed POD-TAS algorithm. Additionally, we compare the performance of a state of the art TAS algorithm, RT-TAS, to our proposed POD-TAS algorithm. Furthermore, we utilize the COMBS benchmark suite to provide CPU workloads for task scheduling. Our experimental results on a multi-core processor using a set of 4 benchmarks demonstrate that the proposed POD-TAS method can improve thermal performance by decreasing the peak thermal variance by 53.0% and the peak chip temperature of 29.01%. Using a set of 8 benchmarks, the comparison of the two algorithms shows a decrease of 29.57% in the peak spatial variance of the chip temperature and 26.26% in the peak chip temperature. We also identify several potential future research directions.

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip

Power-and thermal-aware mapping for NoC under latency constraint

Rapid Generation of Thermal-Safe Test Schedules

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

Thermal-aware small-delay defect testing in integrated circuits

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

Scheduling Tests for 3D Stacked Chips under Power Constraints

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Temperature-aware microarchitecture

Multicast-Based Testing and Thermal-Aware Test Scheduling for 3d Ics with A Stacked Network-On-Chip

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Algorithms for Temperature-Aware Task Scheduling in Microprocessor Systems

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

System-Level Analysis of 3D ICs with Thermal TSVs

Leakage Aware Scheduling for Maximum Temperature Minimization

Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing

Reliable Multiprocessor System-on-chip Synthesis