Abstract:3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12°C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking.

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

A Survey of Optimization Techniques for Thermal-Aware 3D Processors

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Coupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density

Thermal analysis & optimization of a 3 dimensional heterogeneous structure

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal Layout Optimization for 3D Stacked Multichip Modules.

Augmented Cross-Entropy-Based Joint Temperature Optimization of Real-Time 3-D MPSoC Systems

Thermal-aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads

Thermal for 3D stacked modules ?

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

Thermally-Aware Multi-Core Chiplet Stacking

Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint

An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design

A Novel Methodology for Thermal Aware Silicon Area Estimation for 2D & 3D MPSoCs

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Thermal-Aware Task Scheduling for Energy Minimization in Heterogeneous Real-Time MPSoC Systems.

From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0