Abstract:3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12°C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking.

Thermal for 3D stacked modules ?

Thermal Layout Optimization for 3D Stacked Multichip Modules.

Thermal analysis & optimization of a 3 dimensional heterogeneous structure

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Thermal Modeling of a Chiplet-Based Packaging with a 2.5-D Through-Silicon Via Interposer

System-Level Analysis of 3D ICs with Thermal TSVs

Investigation On The Effect Of Multiple Parameters Towards Thermal Management In 3d Stacked Ics

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Electronic Components Placement Optimization under Thermo-Mechanical Loads

MULTI-OBJECTIVE DESIGN OF THE MULTI-PHASE MICROSTRUCTURE FOR THERMAL CONDUCTIVITY OPTIMIZATION

Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

Thermal Simulation Of 3-D Stacked Integrated Circuits With Layered Finite Element Method

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips

Coupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

A Survey of Optimization Techniques for Thermal-Aware 3D Processors

Efficient Thermal Management Strategies for 3D-SiP Architectures