Different Charging Behaviors Between Electrons and Holes in Si Nanocrystals Embedded in SiN X Matrix by the Influence of Near-Interface Oxide Traps

Fang Zhong-Hui,Jiang Xiao-Fan,Chen Kun-Ji,Wang Yue-Fei,Li Wei
DOI: https://doi.org/10.1088/1674-1056/24/1/017305
2015-01-01
Chinese Physics B
Abstract:Si-rich silicon nitride films are prepared by plasma-enhanced chemical vapor deposition method, followed by thermal annealing to form the Si nanocrystals (Si-NCs) embedded in SiNx floating gate MOS structures. The capacitance-voltage (C-V), current-voltage (I-V), and admittance-voltage (G-V) measurements are used to investigate the charging characteristics. It is found that the maximum flat band voltage shift (Delta V-FB) due to full charged holes (similar to 6.2 V) is much larger than that due to full charged electrons (similar to 1 V). The charging displacement current peaks of electrons and holes can be also observed by the I-V measurements, respectively. From the G-V measurements we find that the hole injection is influenced by the oxide hole traps which are located near the SiO2/Si-substrate interface. Combining the results of C-V and G-V measurements, we find that the hole charging of the Si-NCs occurs via a two-step tunneling mechanism. The evolution of G-V peak originated from oxide traps exhibits the process of hole injection into these defects and transferring to the Si-NCs.
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