Abstract:HfO2-based resistive random-access memory (RRAM) with a Ti buffer layer has been extensively studied as an emerging nonvolatile memory (eNVM) candidate because of its excellent resistive switching (RS) properties and CMOS process compatibility. However, a detailed understanding of the nature of Ti thickness-dependent RS and systematic thermal degradation research about the effect of post-metallization annealing (PMA) time on oxygen vacancy distribution and RS performance still needs to be included. Herein, the impact of Ti buffer layer thickness on the RS performance of the Al/Ti/HfO2/TiN devices is first addressed. Consequently, we have proposed a simple strategy to regulate the leakage current, forming voltage, memory window, and uniformity by varying the thickness of the Ti layer. Moreover, it is found that the device with 15 nm Ti shows the minimum cycle-to-cycle variability (CCV) and device-to-device variability (DDV), good retention (105 s at 85 °C), and superior endurance (104). In addition, thermal degradation of the Al/Ti(15 nm)/HfO2/TiN devices under different PMA times at 400 °C is carried out. It is found that the leakage current increases and the forming voltage and memory window decrease with the increase in PMA time due to the thermally activated oxidation of the Ti. However, when the PMA time increases to 30 min, the Ti can no longer capture oxygen from HfO2 due to the formation of self-limited TiOx. Therefore, the device shows superior thermal stability with a PMA time of 90 min at 400 °C and no degradation of the memory window, uniformity, endurance, or retention. This work demonstrates that the Ti/HfO2-based RRAM shows superior back-end-of-line compatibility with high thermal stability up to 400 °C for over an hour.

Investigation on the Response of TaO $_{\rm X}$ -Based Resistive Random-Access Memories to Heavy-Ion Irradiation

Ti/HfO2-Based RRAM with Superior Thermal Stability Based on Self-Limited TiOx

Total Ionizing Dose (TID) Effects on $\hbox{tao}_{x}$ -Based Resistance Change Memory

Electrothermal Modeling and Simulation of Resistive Random Access Memory (RRAM) with Different Resistive Switching Oxides

The Heavy Ion Radiation Effects On The Pt/Hfo2/Ti Resistive Switching Memory

The heavy ion radiation effects on the Pt/HfO<inf>2</inf>/Ti resistive switching memory

Total ionizing dose (TID) effects of γ ray radiation on switching behaviors of Ag/AlO x /Pt RRAM device.

Proton-based total-dose irradiation effects on Cu/HfO2:Cu/Pt ReRAM devices.

Thermal impact on the resistance switching properties in tantalum oxide based RRAM

Highly Stable Radiation-Hardened Resistive-Switching Memory

Study on High-Resistance State Instability of TaOx-Based RRAM

Forming-Free HfO 2 -Based Resistive Random Access Memory by X-Ray Irradiation

Total Ionizing Dose Effects on TiN/Ti/HfO2/TiN Resistive Random-Access Memory Studied via Electrically Detected Magnetic Resonance

The Tid Effects Of Rram Based Oxide Material

Investigation on High Resistance Variation of Bi-layer TaO<inf>x</inf>/HfO<inf>2</inf> RRAM Devices

Short Time High-Resistance State Instability of TaOx-Based RRAM Devices

Role and optimization of thermal rapid annealing in Ta/TaOx/Ru based resistive switching memory

Operando diagnostic detection of interfacial oxygen ‘breathing’ of resistive random access memory by bulk-sensitive hard X-ray photoelectron spectroscopy

Thermal Stability of HfO X -Based Resistive Memory Array: A Temperature Coefficient Study

Localized Metal Doping Effect on Switching Behaviors of TaOx-based RRAM Device

Novel bipolar TaOx-based Resistive Random Access Memory