Abstract:HfO2-based resistive random-access memory (RRAM) with a Ti buffer layer has been extensively studied as an emerging nonvolatile memory (eNVM) candidate because of its excellent resistive switching (RS) properties and CMOS process compatibility. However, a detailed understanding of the nature of Ti thickness-dependent RS and systematic thermal degradation research about the effect of post-metallization annealing (PMA) time on oxygen vacancy distribution and RS performance still needs to be included. Herein, the impact of Ti buffer layer thickness on the RS performance of the Al/Ti/HfO2/TiN devices is first addressed. Consequently, we have proposed a simple strategy to regulate the leakage current, forming voltage, memory window, and uniformity by varying the thickness of the Ti layer. Moreover, it is found that the device with 15 nm Ti shows the minimum cycle-to-cycle variability (CCV) and device-to-device variability (DDV), good retention (105 s at 85 °C), and superior endurance (104). In addition, thermal degradation of the Al/Ti(15 nm)/HfO2/TiN devices under different PMA times at 400 °C is carried out. It is found that the leakage current increases and the forming voltage and memory window decrease with the increase in PMA time due to the thermally activated oxidation of the Ti. However, when the PMA time increases to 30 min, the Ti can no longer capture oxygen from HfO2 due to the formation of self-limited TiOx. Therefore, the device shows superior thermal stability with a PMA time of 90 min at 400 °C and no degradation of the memory window, uniformity, endurance, or retention. This work demonstrates that the Ti/HfO2-based RRAM shows superior back-end-of-line compatibility with high thermal stability up to 400 °C for over an hour.

Highly Stable Radiation-Hardened Resistive-Switching Memory

Ti/HfO2-Based RRAM with Superior Thermal Stability Based on Self-Limited TiOx

HfO2-Based Highly Stable Radiation-Immune Ferroelectric Memory

Electrothermal Modeling and Simulation of Resistive Random Access Memory (RRAM) with Different Resistive Switching Oxides

An HfO2-based Resistive Switching Memory Device with Good Anti-Radiation Capability

Research on Single Event Effect Test of a RRAM Memory and Space Flight Demonstration

The Heavy Ion Radiation Effects On The Pt/Hfo2/Ti Resistive Switching Memory

&Amp;#x03b3;-Ray Irradiation Effects on TiN/HfO<inf>x</inf>/Pt Resistive Random Access Memory Devices

A Radiation Hardened SRAM in 180-nm RHBD Technology.

Total ionizing dose (TID) effects of γ ray radiation on switching behaviors of Ag/AlO x /Pt RRAM device.

The heavy ion radiation effects on the Pt/HfO<inf>2</inf>/Ti resistive switching memory

Γ-Ray Radiation Effects on an HfO2-Based Resistive Memory Device

Total Ionizing Dose Effects on Resistance Stability of Pt/HfO2/Al2O3/TiN Structure RRAM Devices

Proton-based total-dose irradiation effects on Cu/HfO2:Cu/Pt ReRAM devices.

The Tid Effects Of Rram Based Oxide Material

Radiation Tolerance against TID Effect of CuxSiyO-based RRAM

Thermally Stable Transparent Resistive Random Access Memory Based on All‐Oxide Heterostructures

A Radiation-Hardening Ta/Ta2O5-x/Al2O3/InGaZnO4 Memristor for Harsh Electronics

Investigation on the Response of TaO $_{\rm X}$ -Based Resistive Random-Access Memories to Heavy-Ion Irradiation

Total Ionizing Dose (TID) Effects on $\hbox{tao}_{x}$ -Based Resistance Change Memory

Resistive Switching Properties of HfO[sub 2]-Based ReRAM with Implanted Si/Al Ions