Abstract:This work presents our recent research and development of environment-friendly MEMS fabrication technology based on an eco-friendly silicon deep reactive ion etching (D-RIE), and polymer-MEMS utilizing hot embossing process. In order to show the capability of this ‘Green’ fabrication technology, several typical MEMS devices have been fabricated successfully. Regarding silicon dry etching technology, the often-used gas SF6 which has very high Global Warming Potentials (GWP) should be replaced by other lower GWP gases, such as Ar/F2. First, the gases were selected with consideration of the simple handle and less danger. Then, Si etching experiments corresponding to these gases were performed and analyzed systematically to find out the most suitable process which can reduce or replace SF6 gas. Furthermore, the etching rate improvement was also studied based on process’s real-time monitoring and feed-back control technology to optimize the timing of deposition and etching steps (Bosch process); therefore, bias RF power can be smartly controlled during the process. In polymer-MEMS technology, we have developed a novel fabrication of a monolithic PMMA MEMS devices utilizing hot embossing, surface-activated direct bonding, polishing, and elliptical vibration cutting processes. The robustness and capability of the method are demonstrated through the fabrication of sophisticated PMMA freestanding micro structures and devices. An efficient technique using reinforcement material to protect the PMMA microstructures during release process was proposed. Small Young’s modulus and high thermal expansion of polymer are the advantages for electrostatic and thermal actuators, respectively, because it will require less power than silicon counterparts to produce the same displacement. All PMMA acceleration sensor, actuators and mirror device have been fabricated to shows the advantages of polymer-MEMS technology. Fig. 1 shows typical MEMS devices made of PMMA polymer by using our polymer-MEMS fabrication process.

Fabrication of SOI MEMS Inertial Sensors with Dry Releasing Process

A single-mask dry-release process for fabrication of high aspect ratio SOI MEMS devices

A Single Mask Dry Releasing Process for Making High Aspect Ratio Soimemsdevices.

An In-Plane Low-Noise Accelerometer Fabricated with an Improved Process Flow

SOI Micro-Accelerometer Fabricated with Anti-Footing Technique

Fabrication Challenges and Test Structures for High-Aspect-ratio SOI MEMS Devices with Refilled Electrical Isolation Trenches

Thin Layer Soi-Fets Used for Stress-Sensing and Its Application in Accelerometers

An SOI-based post-fabrication process for compliant MEMS devices

Fabrication of Monolithic Integrated MEMS Resonator with Wet-Release-monitoring Array

The Method of Prevent Footing Effect in Making SOI Micro-Mechanical Structure

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Oxide Or Metal Interface Damage Improvement Of Deep Silicon Etch Process By Low Power Rf Of Low Frequency

Design, fabrication and testing of a SOI accelerometer

The SOI DAWN process for three-dimensional silicon micromachining and its applications

12 inch MEMS process for sensors implementation and integration

Fabrication of Monolithic Silicon Multi-Sensor on SOI Wafer

Fabrication and wafer-level vacuum packaging of MEMS resonant pressure sensor

Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method

Environment Friendly MEMS Process

Fabricating Processes of Free-Standing Silicon Nitride Thin Film for MEMS Devices