Abstract:This work has successfully integrated thick SCS and thin film poly-Si microstructures on a SOI wafer using monolithic processes. Thus high optical quality SOI micromirror and large output microactuators are available using the thick SOI wafer. Moreover, the poly-Si thin film microstructures serve as microhinges and stress-induced self-assembly mechanisms. The microstructures will be lifted and assembled by Si(x)N(y)poly-Si bimorph beams after releasing. This work adopted in-plane movable optical stage and out-of-plane pop-up mirror to demonstrate the characteristic of proposed process. Some reliability testing results showed that the SixNy /Poly-Si bimorph beam was reliable for self-assembly applications. In summary, this integrated process can substantially increase the feasibility and extensibility of fabricating I EMS devices using single crystal silicon (SCS) and poly-Si. In applications, various 3-dimesional optical devices, such as optical switches, variable optical attenuators, and micro-scanners, can be developed by proposed process after assembling the SCS micromirror and poly-Si microstructures.

The SOI DAWN process for three-dimensional silicon micromachining and its applications

Design and Fabrication of Multi-Degrees-of-freedom Single Crystal Silicon Moveable Platforms on SOI Wafer

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

A single-mask dry-release process for fabrication of high aspect ratio SOI MEMS devices

Bulk Micromachining Fabrication Platform Using the Integration of DRIE and Wet Anisotropic Etching

A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (1 1 1) Si for MOEMS

Fabrication of SOI MEMS Inertial Sensors with Dry Releasing Process

A Single Mask Dry Releasing Process for Making High Aspect Ratio Soimemsdevices.

Integrating SOI and poly-Si surface structures using a monolithic process

Integrating The Soi And Poly-Si Surface Structures In A Monolithic Process For Optical Devices Platform

Patterned Microstructure Array Fabrication By Using A Novel Standing Surface Acoustic Wave Device

Three-dimensional integration of suspended single-crystalline silicon MEMS arrays with CMOS

Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections

Fabrication of MEMS Resonators in Thin SOI

Microfabrication Technology of Three-Dimensional Microdevices and Their Mems Applications

Fabrication Of Integrated Waveguide Turning Mirror On Silicon-On-Insulator

Fabrication Comparison of the SCS-Based and SOI-Based Micromachining

IC Simulations of the On-chip Integration for SOI CMOS and MEMS

An SOI–MEMS Technology Using Substrate Layer and Bonded Glass As Wafer-Level Package

An SOI-based post-fabrication process for compliant MEMS devices

A CMOS Compatible Process for Monolithic Integration of High-Aspect-ratio Bulk Silicon Microstructures