Design and Fabrication of Multi-Degrees-of-freedom Single Crystal Silicon Moveable Platforms on SOI Wafer

HY Chu,SW Lee,WL Fang
DOI: https://doi.org/10.1109/sensor.2005.1496522
2005-01-01
Abstract:This study has developed various out-of-plane springs and actuators on an SOI wafer using the DAWN process. Further, the integration of these out-of-plane components with the existing in-plane components is also demonstrated. Thus, various multi-degrees-of-freedom (DOF) movable platforms made of single-crystal-silicon (SCS) are implemented on an SOI wafer. In short, the platforms are moveable in in-plane/out-of-plane directions; and linear/angular motions can be achieved. The movable platforms can be driven by several different mechanisms, such as electrothermal or electrostatic actuators. In applications, four movable platforms with 2/spl sim/3 DOF on an SOI wafer are demonstrated.
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