A new self-aligned BOI (Body-on-insulator) finfet fabricated on bulk SI wafers

Runsheng Wang,Xiaoyan Xu,Jing Zhuge,Gang Chen,Wenhua Wang,Xing Zhang,Yangyuan Wang,Ru Huang
2008-01-01
Abstract:In this paper, a new bulk device structure named BOI (Body-on-Insulator) FinFETs, which can combine the advantages of both SOI FinFETs and bulk FinFETs, is proposed and experimentally demonstrated for the first time with compatible CMOS processes. Compared to other bulk FinFETs, the BOI FinFET features the localized insulator below the Si-Fin body, which can effectively suppress the source-drain leakage beneath the Si-Fin channel, and achieve low source/drain parasitic resistance as well as good heat dissipation. High driving current, low subthreshold swing and excellent SCE-immunity are observed in the fabricated BOI FinFETs, demonstrating their viability as an alternative bulk device for future CMOS technology.
What problem does this paper attempt to address?