High Performance SiGe Body-On-Insulator (BOI) FinFET Fabricated on Bulk Si Substrate Using Ge Condensation Technique

Zhexuan Ren,Xia An,Bingxin Zhang,Shuang Sun,Fei Gao,Ming Li,Xing Zhang,Ru Huang
DOI: https://doi.org/10.1109/led.2020.3007333
IF: 4.8157
2020-09-01
IEEE Electron Device Letters
Abstract:A novel high performance SiGe Body-On-Insulator (BOI) FinFET device fabricated on bulk silicon substrate is demonstrated in this letter. A key fabrication process of "isotropic etching + Ge condensation" is firstly proposed to simultaneously achieve localized insulator below SiGe Fin and suppressed diffusion of Ge atoms, as well as increased Ge content in the channel. The process is compatible with conventional CMOS technology with low cost based on bulk Si substrate. Compared with control bulk Si FinFET fabricated with similar process, the off-state leakage current (I $_{textit {off}}$ ) and the on current (I $_{textit {on}}$ ) of SiGe BOI FinFET is at least one order of magnitude smaller and $2times $ larger, respectively, suggesting excellent application potential of the device.
engineering, electrical & electronic
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