Research on Anodic Bonding Process Using Taguchi Method for Maximum Tensile Strength

CHEN Ming-xiang,YI Xian-jian,GAN Zhi-yin,LIU Sheng
DOI: https://doi.org/10.3969/j.issn.1007-4252.2005.03.026
2005-01-01
Abstract:Anodic bonding quality was quantitatively evaluated in terms of tensile strength. The strength of anodically bonded silicon-glass samples was investigated for 81 different bonding conditions, three conditions for each of the four parameters, including bonding temperature, cooling rate, annealing temperature and annealing time. Taguchi method was used to reduce the number of experiments required for the bonding quality evaluation, thus resulting in 9 experiment cases out of 81 possible cases. Fracture strength was measured with an in-house tensile testing machine. The influence of bonding process conditions on the tensile strength was quantified and discussed. It is found that the cooling rate after bonding is the most dominant factor influencing the anodic bonding strength and low cooling rate after bonding will result in high strength. Some ruptured interfaces after tensile testing are analyzed by SEM and the failure mechanisms are discussed.
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