Abstract:The rapid development of MEMS (micro-electro-mechanical systems) has received significant attention from researchers in various fields and subjects. In particular, the MEMS fabrication process is elaborate and, as such, has been the focus of extensive research inquiries. However, in MEMS fabrication, component bonding is difficult to achieve and requires a complex approach. Thus, improvements in bonding quality are relatively important objectives. A higher quality bond can only be achieved with improved measurement and testing capabilities. In particular, the traditional testing methods mainly include infrared testing, tensile testing, and strength testing, despite the fact that using these methods to measure bond quality often results in low efficiency or destructive analysis. Therefore, this paper focuses on the development of a precise, nondestructive visual testing method based on wavelet image analysis that is shown to be highly effective in practice. The process of wavelet image analysis includes wavelet image denoising, wavelet image enhancement, and contrast enhancement, and as an end result, can display an image with low background noise. In addition, because the wavelet analysis software was developed with MATLAB, it can reveal the bonding boundaries and bonding rates to precisely indicate the bond quality at all locations on the wafer. This work also presents a set of orthogonal experiments that consist of three prebonding factors, the prebonding temperature, the positive pressure value and the prebonding time, which are used to analyze the prebonding quality. This method was used to quantify the quality of silicon-to-silicon wafer bonding, yielding standard treatment quantities that could be practical for large-scale use.

Evaluation method for MEMS silicon-glass anodic bonding process

A New Test Structure To Measure Bonding Strength In Micro-Bonding Area

Research on the Failed Mechanism of Anodic Bonding of Silicon to Glass

Silicon-Silicon Anodic Bonding Process With Embedded Glass

Research on Anodic Bonding Process Using Taguchi Method for Maximum Tensile Strength

Study on the mechanism of glass-SiC-glass anodic bonding process

Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging

The Electrostatic-Alloy Bonding Technique Used in Mems

Evaluation of Mechanical Quality of Field-Assisted Diffusion Bonding by Ultrasonic Nondestructive Method

Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

Technique and Structure for Testing Bonding Intension in Micron Scale

Investigation of the Reliability of the Interconnection between Metal Electrode and Silicon Anchor in Silicon-on-Glass Process

APPLICATION OF SUPER-MICRO TESTER IN MEMS BONDING STRENGTH TEST

Residual stress in absolute pressure sensor using Si-Glass anodic bonding

A quality quantitative method of silicon direct bonding based on wavelet image analysis

Study on Anodic Bonding Process of Slender Vitreous Body

Bonding of Glass-Based Microfluidic Chips at Low- or Room-Temperature in Routine Laboratory

Study on Au-Si Bonding of Wafer Level MEMS Vacuum Packaging

Mechanical Strength Measurement of Micro Anchor-Beam Combined Structure Fabricated by Silicon-on-glass Process

Bonding Strength at Micro and Nano Levels

Low-Temperature Silicon-to-Silicon Anodic Bonding Using Sodium-Rich Glass for MEMS Applications