Abstract:Micro-electro-mechanical system (MEMS) is a newly rising interdisciplinary, technology. The mechanical design of MEMS is one of the frontiers of mechanical engineering. The increasing use of small micro-electro-mechanical system (MEMS) and advanced sensors has lead to concern about the failure modes and reliability of these structures. This depends on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. This paper takes up the key point among the existing problems in the development of MEMS, the mechanical behavior of MEMS materials, for investigating experimentally in detail. To investigate the specimen size influence on fracture strength of microstructures, the validity of a novel, direct and convenient method for bending strength measurements by beam bending using a nanoindenter has been demonstrated. The tensile strength of polysilicon thin films was measured with a microtensile test device with a magnet solenoid actuator and a fibre optical displacement sensor. The bending strength of microfabricated polysilicon beams with dimensions of 16 ∼ 34 μm long, 10 ∼ 50 μm wide, and 2.4 μm thick was evaluated. The tensile mechanical properties of microfabricated polysilicon thin films with dimensions of 100 ∼ 660 μm long, 20 ∼ 200 μm wide, and 2.4 μm thick were also evaluated. The result shows that bending strength and tensile strength of polysilicon microstructures show size effect on the size of the specimens. Statistical analysis of bending strength and tensile strength for various specimen sizes shows that the average bending strength of polysilicon microcantilever beams is (2.885 ± 0.408) GPa, and the average tensile strength of polysilicon thin films is (1.36 ± 0.14) GPa. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area and the volume of the specimens due to microstructural and dimensional constrains. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS structures.

Technique and Structure for Testing Bonding Intension in Micron Scale

A New Test Structure To Measure Bonding Strength In Micro-Bonding Area

On Line Measurement of Maximal Torsional Strength of Micro Level Structure

APPLICATION OF SUPER-MICRO TESTER IN MEMS BONDING STRENGTH TEST

Study and Measurement of Micro-Scale Bonding Strength in Vertical Direction

Bonding Strength at Micro and Nano Levels

A Universal Structure for Self-Aligned in Situ On-Chip Micro Tensile Fracture Strength Test

Scale Dependence of Tensile Strength of Micromachined Polysilicon MEMS Structures Due to Microstructural and Dimensional Constraints

Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS

Device for the measurement of anchor torsional strength in MEMS devices

Mechanical Strength Measurement of Micro Anchor-Beam Combined Structure Fabricated by Silicon-on-glass Process

Test Structures and Drie Topography for Bulk Silicon Mems Devices

An integrated push-to-pull micromechanical device: Design, fabrication, and in-situ experiment

RESEARCH OF THE SIZE EFFECT ON STRENGTH OF POLYSILICON MICRO-ELECTRO-MECHANICAL DEVICES

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Dimension effect on mechanical behavior of silicon micro-cantilever beams

DETERMINATION OF MECHANICAL BEHAVIOR OF MEMS MATERIALS

Measurement of mechanical properties for MEMS materials

Mechanical Strength and Interfacial Failure Analysis of Cantilevered SU-8 Microposts

A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique

Evaluation method for MEMS silicon-glass anodic bonding process