Bonding Strength at Micro and Nano Levels

阮勇,尤政,张大成
2012-01-01
Abstract:This paper focuses on micro and nano bonding technology and bonding strength. The micro electro mechanical system (MEMS) models were set up and improved. A series of single crystal cantilever beams were designed, fabricated and tested for the maximum shear stress and pressure stress measurement of bonding strength at micro or nano levels. The formula and ANSYS simulation results are consistent with the experimental ones. Bonding strength can be considered as two parts: torsional strength and pressure stress. The maximum torsional strength is 1.9 × 109 μN · μm and the maximum pressure stress is 68.3 MPa.
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