Abstract:Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate knowledge on the mechanical behaviors of thin film materials used for MEMS is important for successful design and development of MEMS. Here a novel electroplating spring-bridge micro-tensile specimen integrates pin-pin align holes, misalignment compensate spring, load sensor beam and freestanding thin film is demonstrated and fabricated. The specimen is fit into a specially designed micro-mechanical apparatus to carry out a series of monotonic tensile testing on sub-micron freestanding thin films. Certain thin films applicable as structure or motion gears in MEMS were tested including sputtered gold, copper and tantalum nitride thin films. Metal specimens were fabricated by sputtering; for tantalum nitride film samples, nitrogen gas was introduced into the chamber during sputtering tantalum films on the silicon wafer. The sample fabrication method involves three steps of lithography and two steps of electroplating copper to hold a dog bone freestanding thin film. Using standard wet etching or lift off techniques, a series of microtensile specimens were patterned in metal thin films, holes, and seed layer for spring and frame structure on the underlying silicon oxide coated silicon substrate. Two steps of electroplating processing to distinct spring and frame portion of the test chip. Finally, chemical etched away the silicon oxide to separated electroplated specimen and silicon substrate.

APPLICATION OF SUPER-MICRO TESTER IN MEMS BONDING STRENGTH TEST

Technique and Structure for Testing Bonding Intension in Micron Scale

A New Test Structure To Measure Bonding Strength In Micro-Bonding Area

On Line Measurement of Maximal Torsional Strength of Micro Level Structure

Study and Measurement of Micro-Scale Bonding Strength in Vertical Direction

Device for the measurement of anchor torsional strength in MEMS devices

Bonding Strength at Micro and Nano Levels

Mechanical Strength Measurement of Micro Anchor-Beam Combined Structure Fabricated by Silicon-on-glass Process

Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS

A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique

A Universal Structure for Self-Aligned in Situ On-Chip Micro Tensile Fracture Strength Test

Evaluation method for MEMS silicon-glass anodic bonding process

Measurement of mechanical properties for MEMS materials

DETERMINATION OF MECHANICAL BEHAVIOR OF MEMS MATERIALS

Nondestructive Characterization of Quantitative Bonding Strength at A Bonded Solid-Solid Interface

Mechanical Strength and Interfacial Failure Analysis of Cantilevered SU-8 Microposts

Micro-mechanical Characterisation for MEMS Thin Films by Bending Μ-Machined Cantilevers

A Dual-Parameter On-Chip Test Platform Based on Thermal Actuator for Testing Fracture Strength of Microstructure

Dimension effect on mechanical behavior of silicon micro-cantilever beams

Measurement of static and dynamic friction coefficients of sidewalls of bulk-microfabricated MEMS devices with an on-chip micro-tribotester

A Thermal Actuated Test Platform for in Situ Evaluating the Tensile Fracture Strength of Micro-Structures