Micro-mechanical Characterisation for MEMS Thin Films by Bending Μ-Machined Cantilevers
JH He,DF Moore,H Taylor,M Boutchich,P Boyle,G McShane,M Hopcroft,JK Luo
DOI: https://doi.org/10.1109/asdam.2004.1441217
2004-01-01
Abstract:A simple, cost-effective, mu-mechanical characterisation process is developed. It con he applied to a wide range of materials, including non-conductive material, This technique is based on mu-machined beam bending. The beams of the material Under test, are patterned by laser micromachining and released by alkaline etching. A surface profilometer stylus is then used to scan along the cantilevers deflecting them and yielding position-displacement traces, from which the thin film's elastic modulus can be extracted A consistent data analysis method is developed to extract the modulus from such traces. LPCVD SiN cantilevers are fabricated and the Young's modulus is extracted 155+/-20 GPa. Finite Element Modelling (FEM) is used to analyse the beam behaviour.