Abstract:Micro-electro-mechanical system (MEMS) is a newly rising interdisciplinary, technology. The mechanical design of MEMS is one of the frontiers of mechanical engineering. The increasing use of small micro-electro-mechanical system (MEMS) and advanced sensors has lead to concern about the failure modes and reliability of these structures. This depends on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. This paper takes up the key point among the existing problems in the development of MEMS, the mechanical behavior of MEMS materials, for investigating experimentally in detail. To investigate the specimen size influence on fracture strength of microstructures, the validity of a novel, direct and convenient method for bending strength measurements by beam bending using a nanoindenter has been demonstrated. The tensile strength of polysilicon thin films was measured with a microtensile test device with a magnet solenoid actuator and a fibre optical displacement sensor. The bending strength of microfabricated polysilicon beams with dimensions of 16 ∼ 34 μm long, 10 ∼ 50 μm wide, and 2.4 μm thick was evaluated. The tensile mechanical properties of microfabricated polysilicon thin films with dimensions of 100 ∼ 660 μm long, 20 ∼ 200 μm wide, and 2.4 μm thick were also evaluated. The result shows that bending strength and tensile strength of polysilicon microstructures show size effect on the size of the specimens. Statistical analysis of bending strength and tensile strength for various specimen sizes shows that the average bending strength of polysilicon microcantilever beams is (2.885 ± 0.408) GPa, and the average tensile strength of polysilicon thin films is (1.36 ± 0.14) GPa. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area and the volume of the specimens due to microstructural and dimensional constrains. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS structures.

RESEARCH OF THE SIZE EFFECT ON STRENGTH OF POLYSILICON MICRO-ELECTRO-MECHANICAL DEVICES

Size Effect on the Mechanical Properties of Microfabricated Polysilicon Thin Films

Scale Dependence of Tensile Strength of Micromachined Polysilicon MEMS Structures Due to Microstructural and Dimensional Constraints

Specimen Size Effect on Fracture Strength of Polysilicon Microcantilever Beam s

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Specimen Size Effect on Mechanical Properties of Polysilicon Microcantilever Beams Measured by Deflection Using A Nanoindenter

Surface Roughness Effect on the Tensile Strength of Micromachined Polysilicon Films

Dimension effect on mechanical behavior of silicon micro-cantilever beams

MEASUREMENT OF THE FRACTURE PROPERTY OF POLYSILICON MICRO STRUCTURE

Experimental and Theoretical Study of Young Modulus in Micromachined Polysilicon Films

Technique and Structure for Testing Bonding Intension in Micron Scale

Micromechanical Characterization of Polysilicon Films through On-Chip Tests

A New Test Structure To Measure Bonding Strength In Micro-Bonding Area

Recent Efforts in Modelling Combined Rate, Size and Thermal Effects on Single Crystal Strength

Performance analysis of Micro-cantilever beams and sensor data fitting

MECHANICAL PROPERTIES AND SCALING EFFECTS IN MICRO-ELECTRO-MECHANICAL SYSTEMS

Measurement of mechanical properties for MEMS materials

A Micro-Tensile Method for Measuring Mechanical Properties of Mems Materials

Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses

Size Effects in Micro-bending Deformation of MEMS Devices Based on the Discrete Dislocation Theory

DETERMINATION OF MECHANICAL BEHAVIOR OF MEMS MATERIALS