Abstract:Micro-electro-mechanical system (MEMS) is a newly rising interdisciplinary, technology. The mechanical design of MEMS is one of the frontiers of mechanical engineering. The increasing use of small micro-electro-mechanical system (MEMS) and advanced sensors has lead to concern about the failure modes and reliability of these structures. This depends on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. This paper takes up the key point among the existing problems in the development of MEMS, the mechanical behavior of MEMS materials, for investigating experimentally in detail. To investigate the specimen size influence on fracture strength of microstructures, the validity of a novel, direct and convenient method for bending strength measurements by beam bending using a nanoindenter has been demonstrated. The tensile strength of polysilicon thin films was measured with a microtensile test device with a magnet solenoid actuator and a fibre optical displacement sensor. The bending strength of microfabricated polysilicon beams with dimensions of 16 ∼ 34 μm long, 10 ∼ 50 μm wide, and 2.4 μm thick was evaluated. The tensile mechanical properties of microfabricated polysilicon thin films with dimensions of 100 ∼ 660 μm long, 20 ∼ 200 μm wide, and 2.4 μm thick were also evaluated. The result shows that bending strength and tensile strength of polysilicon microstructures show size effect on the size of the specimens. Statistical analysis of bending strength and tensile strength for various specimen sizes shows that the average bending strength of polysilicon microcantilever beams is (2.885 ± 0.408) GPa, and the average tensile strength of polysilicon thin films is (1.36 ± 0.14) GPa. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area and the volume of the specimens due to microstructural and dimensional constrains. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS structures.

Specimen Size Effect on Fracture Strength of Polysilicon Microcantilever Beam s

Specimen Size Effect on Mechanical Properties of Polysilicon Microcantilever Beams Measured by Deflection Using A Nanoindenter

RESEARCH OF THE SIZE EFFECT ON STRENGTH OF POLYSILICON MICRO-ELECTRO-MECHANICAL DEVICES

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Size Effect on the Mechanical Properties of Microfabricated Polysilicon Thin Films

Dimension effect on mechanical behavior of silicon micro-cantilever beams

MEASUREMENT OF THE FRACTURE PROPERTY OF POLYSILICON MICRO STRUCTURE

Study on size-dependent young's modulus of a silicon nanobeam by molecular dynamics simulation

Scale Dependence of Tensile Strength of Micromachined Polysilicon MEMS Structures Due to Microstructural and Dimensional Constraints

Performance analysis of Micro-cantilever beams and sensor data fitting

Surface Roughness Effect on the Tensile Strength of Micromachined Polysilicon Films

Experimental and Theoretical Study of Young Modulus in Micromachined Polysilicon Films

Electrical Measurement of Fracture Strength of Polysilicon

Mechanical Characterization of Post-Buckled Micro-Bridge Beams by Micro-Tensile Testing

Mechanical Characterization of Thermal SiO2micro-beams Through Tensile Testing

Method for Electrical Measurement of Fracture Strength of Surface Micromachined Polysilicon Beams Based on a Thermal Actuator

Strength/Crack-Size Relationship for Knoop-Indented Bending Specimens and Its Application to Silicon Nitride Ceramics

A Method of Measuring Young's Modulus and Residual Stress in Typical MEMS Structures Using a Surface Profilometer

Analysis of the influence factors on the measurement of elastic modulus using the microcantilever deflection on a nanoindenter

Mechanical Properties of SiC Coatings on Spherical Particles Measured Using the Micro-Beam Method

Size Effect and Geometrical Effect of Polycrystals and Thin Film/Substrate System in Micro-indentation Test