A Method of Measuring Young's Modulus and Residual Stress in Typical MEMS Structures Using a Surface Profilometer

Hu Wei,Zhang Dacheng,He Xuefeng
DOI: https://doi.org/10.3321/j.issn:1004-132X.2005.z1.152
2005-01-01
Abstract:Knowledge and control of Young's modulus are critical for device design and process monitoring in MEMS, and therefore a simple method of measuring Young's modulus for typical MEMS structures was addressed. In this study, fixed-fixed beam test structures were used to evaluate Young's modulus. A surface profilometer was used to measure the deflection of thin fixed-fixed beams due to the force applied by the profilometer probe. The analytical beam theory is used to analyze these measurements. Measurements and results were presented for LPCVD deposited polysilicon beams. Young's Modulus and residual stress are 163 GPa and 20.8 MPa, respectively.
What problem does this paper attempt to address?