Nanomechanical Characterisation of MEMS Thin Film Materials

J.H. He,J.K. Luo,M.A. Hopcroft,H.R. Le,D.F. Moore
DOI: https://doi.org/10.1504/ijcmsse.2009.027491
2009-01-01
International Journal of Computational Materials Science and Surface Engineering
Abstract:Mechanical characterisation of thin film is crucial for development of MEMS/NEMS devices. A simple mechanical characterisation method is developed using a surface profilometer. Surface profilometer is used to scan along the micromachined cantilevers and produce the bending profile, from which the Young's modulus can be extracted. The following MEMS materials: SiN, Ni, Ni/SiN bimorph, Nanocrystal Diamond (ND), SiC have been characterised. The results are compared and in agreement with those obtained from nanoindentation and resonance frequency method. The advantages and disadvantages of these three methods are discussed.
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