Abstract:Micro-electro-mechanical system (MEMS) is a newly rising interdisciplinary, technology. The mechanical design of MEMS is one of the frontiers of mechanical engineering. The increasing use of small micro-electro-mechanical system (MEMS) and advanced sensors has lead to concern about the failure modes and reliability of these structures. This depends on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. This paper takes up the key point among the existing problems in the development of MEMS, the mechanical behavior of MEMS materials, for investigating experimentally in detail. To investigate the specimen size influence on fracture strength of microstructures, the validity of a novel, direct and convenient method for bending strength measurements by beam bending using a nanoindenter has been demonstrated. The tensile strength of polysilicon thin films was measured with a microtensile test device with a magnet solenoid actuator and a fibre optical displacement sensor. The bending strength of microfabricated polysilicon beams with dimensions of 16 ∼ 34 μm long, 10 ∼ 50 μm wide, and 2.4 μm thick was evaluated. The tensile mechanical properties of microfabricated polysilicon thin films with dimensions of 100 ∼ 660 μm long, 20 ∼ 200 μm wide, and 2.4 μm thick were also evaluated. The result shows that bending strength and tensile strength of polysilicon microstructures show size effect on the size of the specimens. Statistical analysis of bending strength and tensile strength for various specimen sizes shows that the average bending strength of polysilicon microcantilever beams is (2.885 ± 0.408) GPa, and the average tensile strength of polysilicon thin films is (1.36 ± 0.14) GPa. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area and the volume of the specimens due to microstructural and dimensional constrains. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS structures.

Experimental and Theoretical Study of Young Modulus in Micromachined Polysilicon Films

Scale Dependence of Tensile Strength of Micromachined Polysilicon MEMS Structures Due to Microstructural and Dimensional Constraints

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Size Effect on the Mechanical Properties of Microfabricated Polysilicon Thin Films

Micromechanical Characterization of Polysilicon Films through On-Chip Tests

A Method of Measuring Young's Modulus and Residual Stress in Typical MEMS Structures Using a Surface Profilometer

Investigation of fatigue mechanical properties of apolycrystalline solid at mesoscopic scale using depth-sensing indentation (DSI) technique

RESEARCH OF THE SIZE EFFECT ON STRENGTH OF POLYSILICON MICRO-ELECTRO-MECHANICAL DEVICES

Surface Roughness Effect on the Tensile Strength of Micromachined Polysilicon Films

Study of Elastic Modulus and Yield Strength of Polymer Thin Films Using Atomic Force Microscopy

A Simple Method for the Measurement of Young's Moduli of Bilayer Thin Films Based on the Electrostatic Drive Approach

Experimental and Theoretical Study on Mechanical Properties of Porous PDMS

Effective Young's Modulus Measurement of Thin Film Using Micromechanical Cantilever Sensors

MEASUREMENT OF THE FRACTURE PROPERTY OF POLYSILICON MICRO STRUCTURE

Specimen Size Effect on Fracture Strength of Polysilicon Microcantilever Beam s

Specimen Size Effect on Mechanical Properties of Polysilicon Microcantilever Beams Measured by Deflection Using A Nanoindenter

Measurement Of Young'S Modulus And Residual Stress Of Micromembranes

Young’s Modulus of Polycrystalline Titania Microspheres Determined by in Situ Nanoindentation and Finite Element Modeling

Measurement of Young's modulus and residual stress of silicon microstructures

Characterization of the Young's Modulus and Residual Stresses for a Sputtered Silicon Oxynitride Film Using Micro-Structures

Young's Modulus Characterization of Nano-Level Silicon Nanomembrane