Abstract:Micro-electro-mechanical system (MEMS) is a newly rising interdisciplinary, technology. The mechanical design of MEMS is one of the frontiers of mechanical engineering. The increasing use of small micro-electro-mechanical system (MEMS) and advanced sensors has lead to concern about the failure modes and reliability of these structures. This depends on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. This paper takes up the key point among the existing problems in the development of MEMS, the mechanical behavior of MEMS materials, for investigating experimentally in detail. To investigate the specimen size influence on fracture strength of microstructures, the validity of a novel, direct and convenient method for bending strength measurements by beam bending using a nanoindenter has been demonstrated. The tensile strength of polysilicon thin films was measured with a microtensile test device with a magnet solenoid actuator and a fibre optical displacement sensor. The bending strength of microfabricated polysilicon beams with dimensions of 16 ∼ 34 μm long, 10 ∼ 50 μm wide, and 2.4 μm thick was evaluated. The tensile mechanical properties of microfabricated polysilicon thin films with dimensions of 100 ∼ 660 μm long, 20 ∼ 200 μm wide, and 2.4 μm thick were also evaluated. The result shows that bending strength and tensile strength of polysilicon microstructures show size effect on the size of the specimens. Statistical analysis of bending strength and tensile strength for various specimen sizes shows that the average bending strength of polysilicon microcantilever beams is (2.885 ± 0.408) GPa, and the average tensile strength of polysilicon thin films is (1.36 ± 0.14) GPa. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area and the volume of the specimens due to microstructural and dimensional constrains. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS structures.

Surface Roughness Effect on the Tensile Strength of Micromachined Polysilicon Films

Size Effect on the Mechanical Properties of Microfabricated Polysilicon Thin Films

Scale Dependence of Tensile Strength of Micromachined Polysilicon MEMS Structures Due to Microstructural and Dimensional Constraints

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

RESEARCH OF THE SIZE EFFECT ON STRENGTH OF POLYSILICON MICRO-ELECTRO-MECHANICAL DEVICES

MEASUREMENT OF THE FRACTURE PROPERTY OF POLYSILICON MICRO STRUCTURE

Micromechanical Characterization of Polysilicon Films through On-Chip Tests

Role of Microstructure and Doping on the Mechanical Strength and Toughness of Polysilicon Thin Films

The mechanical strength of polysilicon films: Part 1. The influence of fabrication governed surface conditions

Experimental and Theoretical Study of Young Modulus in Micromachined Polysilicon Films

Friction and fracture properties of polysilicon coated with self-assembled monolayers

Specimen Size Effect on Fracture Strength of Polysilicon Microcantilever Beam s

Specimen Size Effect on Mechanical Properties of Polysilicon Microcantilever Beams Measured by Deflection Using A Nanoindenter

Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach

The Effect of Chemical–Mechanical Processing of Silicon Wafers on Their Surface Morphology and Strength

Fracture Properties of MEMS/NEMS Thin Films

On the Fracture Toughness Measurement of Thin Film Coated Silicon Wafers

Influence of Anisotropy on Material Removal and Deformation Mechanism Based on Nanoscratch Tests of Monocrystal Silicon

FATIGUE PROPERTY OF POLYSILICON THIN FILMS IN AMBIENT ENVIRONMENT

An Out-Chip Method for Measuring Fatigue Property of Polysilicon Thin Film

Effect of Micro-Dimple Patterns on Capillary Pull-off Force and Friction Force of Silicon Surface