Abstract:Micro-electro-mechanical system (MEMS) is a newly rising interdisciplinary, technology. The mechanical design of MEMS is one of the frontiers of mechanical engineering. The increasing use of small micro-electro-mechanical system (MEMS) and advanced sensors has lead to concern about the failure modes and reliability of these structures. This depends on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. This paper takes up the key point among the existing problems in the development of MEMS, the mechanical behavior of MEMS materials, for investigating experimentally in detail. To investigate the specimen size influence on fracture strength of microstructures, the validity of a novel, direct and convenient method for bending strength measurements by beam bending using a nanoindenter has been demonstrated. The tensile strength of polysilicon thin films was measured with a microtensile test device with a magnet solenoid actuator and a fibre optical displacement sensor. The bending strength of microfabricated polysilicon beams with dimensions of 16 ∼ 34 μm long, 10 ∼ 50 μm wide, and 2.4 μm thick was evaluated. The tensile mechanical properties of microfabricated polysilicon thin films with dimensions of 100 ∼ 660 μm long, 20 ∼ 200 μm wide, and 2.4 μm thick were also evaluated. The result shows that bending strength and tensile strength of polysilicon microstructures show size effect on the size of the specimens. Statistical analysis of bending strength and tensile strength for various specimen sizes shows that the average bending strength of polysilicon microcantilever beams is (2.885 ± 0.408) GPa, and the average tensile strength of polysilicon thin films is (1.36 ± 0.14) GPa. Statistical analysis of the specimen size effects on the tensile strength predicated the size effects on the length, the surface area and the volume of the specimens due to microstructural and dimensional constrains. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data accounts for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS structures.

Test Structures and Drie Topography for Bulk Silicon Mems Devices

A New Test Structure To Measure Bonding Strength In Micro-Bonding Area

Technique and Structure for Testing Bonding Intension in Micron Scale

Methods to Protect Silicon Microstructures from the Damages in Deep Reactive Ion Etching

Bulk Micromachining Fabrication Platform Using the Integration of DRIE and Wet Anisotropic Etching

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Understanding the Impact of Surface Engineering, Structure, and Design on Electromigration Through Monte Carlo Simulation and In‐Situ SEM Studies

Fabrication Challenges and Test Structures for High-Aspect-ratio SOI MEMS Devices with Refilled Electrical Isolation Trenches

Cryogenic DRIE Processes for High-Precision Silicon Etching in MEMS Applications

Recent Efforts in Modelling Combined Rate, Size and Thermal Effects on Single Crystal Strength

On Line Measurement of Maximal Torsional Strength of Micro Level Structure

Oxide Or Metal Interface Damage Improvement Of Deep Silicon Etch Process By Low Power Rf Of Low Frequency

High Aspect Ratio Si Etching Technique and Application

On-chip testing method for measurements of friction and wear in moveable MEMS devices

A CMOS Compatible Process for Monolithic Integration of High-Aspect-ratio Bulk Silicon Microstructures

Post-CMOS Process for High-Aspect-ratio Monolithically Integrated Single Crystal Silicon Microstructures

Modeling and Simulation of Silicon Dry Etching

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Experimental Study on the Footing Effect for SOG Structures Using DRIE

Study and Measurement of Micro-Scale Bonding Strength in Vertical Direction

RESEARCH OF THE SIZE EFFECT ON STRENGTH OF POLYSILICON MICRO-ELECTRO-MECHANICAL DEVICES