A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

DW Zheng,XH Wang,K Shyu,CT Chang,WJ Wen,KN Tu

DOI: https://doi.org/10.1109/icsict.1998.785950

1998-01-01

Abstract:A novel testing methodology to study the full-field stress distribution in patterned microstructures has been developed for microelectronics applications. The testing structure consists of a Si diaphragm, whose deformation caused by the stress due to an overlying patterned thin film is captured by a Twyman-Green interferometer. The finite element model used to analyze this structure assumes a uniform in-plane biaxial initial stress in the patterned thin film before stress relaxation occurs, and gives the Si diaphragm deflection profile which matches the measured values. Hence the full-field stress in the patterned thin film and Si diaphragm can be given. The stress distribution in an electroless Ni pad on a Si diaphragm is used as an example.