Improvement Of Thin Film Tensile Testing Technology Using Process Integrated Specimen And Considering Its Out-Of-Plane Deformation

yichung lin,chaolin cheng,weileun fang
DOI: https://doi.org/10.1109/transducers.2015.7181041
2015-01-01
Abstract:This study has demonstrated a novel micro testing device to easily fabricate/integrate the thin film specimen, and further improve the measurements of thin film tensile test by considering the out-of-plane deformation (Fig. 1). Due to "nominally-clamped" boundary condition [1] from microfabrication, additional bending moment is introduced during tensile test and cause the specimen an out-of-plane deformation. This study exploits such characteristic to determine thin film elastic modulus and modify the measured fracture strain. Merits of proposed tensile test approach: (1) the presented processes could fabricate/integrate different thin film specimens for testing; and (2) out-of-plane deformation of specimen is considered and precisely measured by interferometer (sub-nm resolution). The test-unit is implemented on Silicon-on-insulation (SOI) wafer. In applications, the mechanical and electrical properties of evaporated gold films are characterized.
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