Abstract:Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. Recently Huang, Rosakis and co-workers [Huang, Y., Ngo, D., Rosakis, A.J., 2005. Non-uniform, axisymmetric misfit strain: in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures. Acta Mech. Sin. 21, 362–370; Huang, Y., Rosakis A.J., 2005. Extension of Stoney’s Formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry. J. Mech. Phys. Solids 53, 2483–2500; Ngo, D., Huang, Y., Rosakis, A. J., Feng, X. 2006. Spatially non-uniform, isotropic misfit strain in thin films bonded on plate substrates: the relation between non-uniform film stresses and system curvatures. Thin Solid Films (in press)] established methods for film/substrate system subject to non-uniform misfit strain and temperature changes. The film stresses were found to depend non-locally on system curvatures (i.e., depend on the full-field curvatures). The existing methods, however, all assume uniform film thickness which is often violated in the thin film/substrate system. We extend these methods to arbitrarily non-uniform film thickness for the thin film/substrate system subject to non-uniform misfit strain. Remarkably the stress-curvature relation for uniform film thickness still holds if the film thickness is replaced by its local value at the point where the stress is evaluated. This result has been experimentally validated in Part II of this paper.

A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution

Ultra-sensitive, Highly Reproducible Film Stress Characterization Using Flexible Suspended Thin Silicon Plates and Local Curvature Measurements

A new method for high resolution curvature measurement applied to stress monitoring in thin films

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Study of Local Stress Using Stress-Absorbing Si Diaphragm

Modification of curvature-based thin-film residual stress measurement for MEMS applications

Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. Part II: Experimental validation of the non-local stress/curvature relations

In Situ and Real-Time Tensile Testing of Thin Films Using Double-Field-of-view Electronic Speckle Pattern Interferometry

Multilayer Thin Films/substrate System with Variable Film Thickness Subjected to Non-Uniform Misfit Strains

Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method

Measuring stiffness and residual stress of thin films by contact resonance atomic force microscopy

A Measuring System for Mechanical Characterization of Thin Films Based on a Compactin Situmicro-Tensile Tester and SEM Moiré Method

A METHOD FOR BIAXIAL F CTU ST' SS TEST OF NANOSCALE FILM

Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature

THIN FILM STRESSES MEASUREMENT AT ELEVATED TEMPERATURES BY DIGITAL GRADIENT SENSING METHOD

Self-contained in-vacuum in situ thin film stress measurement tool

Improvement Of Thin Film Tensile Testing Technology Using Process Integrated Specimen And Considering Its Out-Of-Plane Deformation

Thin Film/substrate Systems Featuring Arbitrary Film Thickness and Misfit Strain Distributions. Part I: Analysis for Obtaining Film Stress from Non-Local Curvature Information

Study of techniques for measuring residual stress in micromachined films

New Internal Stress Driven on-Chip Micromachines for Extracting Mechanical Properties of Thin Films