Abstract:Thin solid films have many applications in a wide range of industries, and consequently are important materials. For structural applications, it is essential to understand the mechanical properties of thin films so that the performance and reliability of thin-film based devices can be optimised. Accurate measurement of the mechanical properties of thin films presents a challenge, as the films are often too thin to allow them to be handled alone and hence they are usually attached to a substrate. A study of the literature demonstrates that significant research effort has been directed towards developing appropriate testing methodologies for mechanical characterisation of thin films in the past two or three decades; however, the existing methods do have limitations due to difficulties in specimen preparation and manipulation, and the lack of unified testing standards. Furthermore, the accuracy obtained in measuring a given mechanical property is often affected by the complex nature of the thin film structure, or the microstructure of the material itself. There is, therefore, a requirement for ongoing effort to develop mechanical characterisation methods that are accurate and cost-effective, especially for ultra-thin films on the nanometric scale. Dynamic testing has been one of the popular approaches used to measure the mechanical properties of thin films. Using the resonant vibration behaviour of a thin-film structure, the material and mechanical properties of the film can be obtained. The technique displays great potential for the mechanical characterisation of thin films, as the sample preparation is relatively simple and the measurement can be self-calibrated. This work aims to systematically investigate the dynamic behaviour of two thin-film structures, including cantilever beams and circular diaphragms, and thus develop novel dynamic testing methodologies for measuring the elastic modulus, density and residual stress of ultra-thin films. A membrane-based resonant method for measuring the tensile residual stress of a circular thin-film diaphragm was developed. In this method, the frequency ratio of the first two symmetric vibration modes was proposed as a criterion based on the RayleighnRitz method. The method was validated using suspended silicon carbide membranes experimentally and numerically, and the tensile stresses measured were in reasonably good agreement with those obtained from the wafer curvature measurement. This approach measures residual stress directly, and does not require any knowledge of film thickness; it can also be extended to any thin solid film with a suspended membrane structure. A novel resonant method was also developed to simultaneously determine the residual stress and elastic modulus of a suspended circular thin-film diaphragm that exhibits a combination of plate and membrane behaviour. The mechanical properties were determined by solving the RayleighnRitz equation theoretically using the experimentally measured resonant frequencies of the first two symmetric vibration modes of the diaphragm. The experimental results were found to be in excellent agreement with the finite element modelling. The modulus and stress values were also in reasonably good agreement with those obtained from the nanoindentation and the wafer curvature measurements, respectively. The limitations of the diaphragm and membrane methods, and the effects of sample preparation and testing environment on measuring accuracy, have also been comprehensively addressed. A simple and practical method was also proposed to simultaneously characterise both the mass density and elastic modulus of a thin film using Euler-Bernoulli beam theory with the measured resonant frequencies of bare and two composite cantilever beams. The method was validated using a sputter-coated Ni film/Si substrate system. The elastic modulus of the Ni film obtained from this method was in excellent agreement with that measured using nanoindentation. This method is of special importance for characterising thin films of porous materials, as the measurement is non-contact and the calculation is only slightly influenced by viscous damping.

In Situ and Real-Time Tensile Testing of Thin Films Using Double-Field-of-view Electronic Speckle Pattern Interferometry

Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method

High-Precision Large Deflection Measurements of Thin Films Using Time Sequence Speckle Pattern Interferometry

Deformation Measurement of A Small Component and A Thin Film Using Time Sequence Speckle Pattern Interferometry

OS5-2-3 an In-Situ Micro-Tension Setup and Its Application

A New Method for the Micro-Tensile Testing of Thin Film

Real-Time and Full-Field Deflection Measurement of Thin Films Electroplated on the Single Crystal Silicon Wafers

A Measuring System for Mechanical Characterization of Thin Films Based on a Compactin Situmicro-Tensile Tester and SEM Moiré Method

Improvement Of Thin Film Tensile Testing Technology Using Process Integrated Specimen And Considering Its Out-Of-Plane Deformation

Design of testing chip for measuring mechanical properties of thin films

Surface Patterning for Multi-Scale Strain Analysis of In-Situ Sem Mechanical Experiments

In Situ Nanoindentation Mechanical Property of Films by Atomic Force Microscope

A Uniaxial Tension System and Its Applications in Testing of Thin Films and Small Components.

Methodology for microscale deformation measurement of free-standing thin films

A New Micro-Tensile System for Measuring the Mechanical Properties of Low-Dimensional Materials - Fibers and Films

Ultra-sensitive, Highly Reproducible Film Stress Characterization Using Flexible Suspended Thin Silicon Plates and Local Curvature Measurements

Large-Scale Strain Measurement of Micro-Specimens in High-Temperature Environments Based on Efpi

An Experimental Method for Micro-Scale Uniaxial Tension Test

Dynamic Characterisation of Mechanical Properties of Ultrathin Films

Optical Full-Field Technique for Measuring Deformation on Micromechanical Components

Process nano scale mechanical properties measurement of thin metal films using a novel paddle cantilever test structure