Abstract:The present work characterizes mechanical (elastic and plastic) properties and residual stresses of a Ni-Co thin film having 10 m thickness. Mechanical properties are obtained from direct-tension testing together with elastic finite element analysis. Membrane and bending components of residual stresses are measured using micro-cantilever and T-structure tests, respectively. Introduction Measurement of residual stresses in thin films is quite important, as their effect on mechanical integrity of micro-electrical-mechanical components could be significant. A number of measurement methods are available [1-7], but a majority of methods deal with measuring averaged residual stresses, rather than thickness-variation of residual stresses in thin films. Although such thickness variation could be often insignificant due to the fact that the thickness is very small, residual stresses can vary along the thickness of thin films. Measuring thickness variations of residual stresses, however, are not straightforward. A sectioning method can be applied (see for instance Ref. [7]), but can be quite tedious. In this respect, a simple method to measure thickness variations is desirable. In designing (macroscopic) structures, a stresses categorization process from stresses in the thickness direction is popularly employed [8-10]. In the stresses categorization process, stresses in the thickness direction are decomposed into the primary, secondary and peak stresses. Primary stresses are ones resulting mechanical loads and dead weights. Secondary stresses include thermal and residual stresses. Both primary and secondary stresses are typically idealized as a sum of (constant) membrane and (linear) bending stress components. Remaining stresses are classified as the peak stress, which relaxes quickly with plastic deformation by definition. A message that can be learnt from conventional stresses categorization process is that determination of membrane and bending components of residual stresses would be sufficient from mechanical integrity point of view. This paper presents measurement of residual stresses in Ni-Co thin films. A linearly-varying residual stress across the film thickness is assumed. To measure its bending and membrane components, cantilever beam and T-structure beam specimens are used, respectively. Experiments Material and Specimen Fabrication A NiCo thin film is recently widely used for MEMS devices using LIGA processes. Fabrication processes of NiCo thin film specimens are schematically shown in Fig. 1. For tensile test, conventional “dogbone” tensile test specimens were fabricated. Furthermore, for residual stress analysis, specimens of T-type structure and cantilever beams (which will be discussed later in this paper) with various dimensions were also fabricated. A single-side

Stress Analysis of Thin Film Thermocouple Sensor Based on Finite Element Simulation

Thermal Stress Analysis of MEMS Accelerometer Based on Finite Element Method

Effect of Stress-Dependent Thermal Conductivity on Thermo-Mechanical Coupling Behavior in GaN-Based Nanofilm under Pulse Heat Source

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Depth-sensing Indentation Measurement and Finite Element Analysis of Residual Stress Field Near Fatigue Crack Tip

Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses

Thermal and Vibration Mechanical Reliability of Multicoat Compound Thin-Film Thermocouple

Thermal Stress Simulation and Structure Failure Analyses of Nitrogen–Oxygen Sensors under a Gradual Temperature Field

Stress analysis of interconnect structure in COF by finite element method

Research of high temperature redundant thin film thermocouple

Thermal stress concentration points and stress mutations in nano-multilayer film structures

High-Temperature Failure Evolution Analysis of K-Type Film Thermocouples

THIN FILM STRESSES MEASUREMENT AT ELEVATED TEMPERATURES BY DIGITAL GRADIENT SENSING METHOD

Study of Local Stress Using Stress-Absorbing Si Diaphragm

A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films

Finite Element Stress Analysis Of 3d Tsv Stack Subject To Large Temperature Loading

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution

Fabrication, Performance, Characterization and Experimental Calibration of Embedded Thin-Film Sensor for Tool Cutting Force Measurement

Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method

An Estimation Method on Failure Stress of Micro Thickness Cu Film-Substrate Structure

Characterization of Mechanical Properties and Residual Stresses for Ni-Co Thin Films