Thermal Stress Analysis of MEMS Accelerometer Based on Finite Element Method

Zhonghe Jin
2012-01-01
Abstract:Residual stress has a significant impact on mechanical properties,lifetime and reliability of MEMS devices.Based on MEMS capacitive accelerometer and thermal structure coupled-field analysis,the effects of thermal stress have been simulated and analyzed,and compared with the experimental results.The results show that thermal stress is not the main factor which may affect the device performance while some physical factors and fabrication error that have not been taken into account of the simulation model are the main factors.The improvement suggestions for the process are put forward,which can provide reference for the perfection of the accelerometer temperature compensation model and redesign of the accelerometer.
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