Evaluation and characterization of titanium to glass anodic bonding

Qiong Shu,Juan Su,Gang Zhao,Ying Wang,Jing Chen
DOI: https://doi.org/10.1115/MicroNano2008-70111
2008-01-01
Abstract:In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of coefficients of thermal expansion (CTE) match, three different types of ion-containing glasses are evaluated: Pyrex 7740, D-263T and soda lime glass. By applying a potential between the two chips and heating them beyond 350 degrees C, soda lime glass samples are successfully bonded with titanium. The influence of the bonding temperature on the bonding strength is revealed. For the first time, wafer level Ti-Glass bond is carried out, a 157-mu m-thick titanium wafer is successfully bonded to a 1000-mu m-thick soda glass wafer at 450 degrees C and applying a voltage of 800V and a force of 1000N for 30min, over 60% of the surface are joined. The results are helpful to define potential applications in certain field of microsystems.
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