Abstract:Silicon nanostructuring imparts unique material properties including antireflectivity, antifogging, anti-icing, self-cleaning, and/or antimicrobial activity. To tune these properties however, a good control over features size and shape is essential. Here, a versatile fabrication process is presented to achieve tailored silicon nanostructures (thin/thick pillars, sharp/truncated/re-entrant cones), of pitch down to ~50 nm, and high-aspect ratio (>10). The approach relies on pre-assembled block copolymer (BCP) micelles and their direct transfer into a glass hard mask of an arbitrary thickness, now enabled by our recently reported regenerative secondary mask lithography. During this pattern transfer, not only the mask diameter can be decreased but also uniquely increased; constituting the first method to achieve such tunability without necessitating a different molecular weight BCP. Consequently, the hard mask modulation (height, diameter) advances the flexibility in attainable inter-pillar spacing, aspect ratios, and re-entrant profiles (= glass on silicon). Combined with adjusted silicon etch conditions, the morphology of nanopatterns can be highly customized. The process control and scalability enable uniform patterning of a 6-inch wafer which is verified through cross-wafer excellent antireflectivity (<5%) and water-repellency (advancing contact angle 158°; hysteresis 1°). It is envisioned the implementation of this approach to silicon nanostructuring to be far-reaching, facilitating fundamental studies and targeting applications spanning solar panels, antifogging/antibacterial surfaces, sensing, amongst many others.

Fabrication of High-Aspect-ratio Silicon Nanopillar Arrays with the Conventional Reactive Ion Etching Technique

Fabrication of Submicrometer Inp Pillars by Colloidal Lithography and Dry Etching

Fabrication of ultrahigh-aspect-ratio and periodic silicon nanopillar arrays using dislocation lithography and deep reactive-ion etching

Wafer Scale Fabrication of Dense and High Aspect Ratio Sub-50 Nm Nanopillars from Phase Separation of Cross-Linkable Polysiloxane/Polystyrene Blend

Self-Formed High-Aspect-Ratio Polymer Nanopillars by RIE

High aspect ratio arrays of Si nano-pillars using displacement Talbot lithography and gas-MacEtch

RIE of SiO_2 Nanoparticles and Its Application in Preparation of Silicon Nanopillar Array

A novel fabrication technique for high-aspect-ratio nanopillar arrays for SERS application

Study on Silicon Nanopillars with Ultralow Broadband Reflectivity Via Maskless Reactive Ion Etching at Room Temperature

Self-masked high-aspect-ratio polymer nanopillars.

Fabrication Of Silicon Cones And Pillars Using Rough Metal Films As Plasma Etching Masks

Fabrication of ultra-high-aspect-ratio nano-walls and nano-structures on silicon substrates

Fabrication of ordered arrays of silicon nanopillars in silicon-on-insulator wafers

Fabrication of the Highly Ordered Silicon Nanocone Array With Sub-5 nm Tip Apex by Tapered Silicon Oxide Mask

Size and Morphology Control of Highly-Ordered Nano-Silicon Pillar Fabricated by Direct Nanosphere Lithography

Fabrication of arrays of tapered silicon micro-/nano-pillars by metal-assisted chemical etching and anisotropic wet etching

A route to engineered high aspect-ratio silicon nanostructures through regenerative secondary mask lithography

Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching

Fabrication of Silicon Hierarchical Nanopillar Arrays Based on Nanosphere Lithography

Fabrication of large-scale periodic silicon nanopillar arrays for 2D nanomold using modified nanosphere lithography☆

Fabrication of 10-nm Si pillars with self-formed etching masks