Abstract:Silicon nanostructuring imparts unique material properties including antireflectivity, antifogging, anti-icing, self-cleaning, and/or antimicrobial activity. To tune these properties however, a good control over features size and shape is essential. Here, a versatile fabrication process is presented to achieve tailored silicon nanostructures (thin/thick pillars, sharp/truncated/re-entrant cones), of pitch down to ~50 nm, and high-aspect ratio (>10). The approach relies on pre-assembled block copolymer (BCP) micelles and their direct transfer into a glass hard mask of an arbitrary thickness, now enabled by our recently reported regenerative secondary mask lithography. During this pattern transfer, not only the mask diameter can be decreased but also uniquely increased; constituting the first method to achieve such tunability without necessitating a different molecular weight BCP. Consequently, the hard mask modulation (height, diameter) advances the flexibility in attainable inter-pillar spacing, aspect ratios, and re-entrant profiles (= glass on silicon). Combined with adjusted silicon etch conditions, the morphology of nanopatterns can be highly customized. The process control and scalability enable uniform patterning of a 6-inch wafer which is verified through cross-wafer excellent antireflectivity (<5%) and water-repellency (advancing contact angle 158°; hysteresis 1°). It is envisioned the implementation of this approach to silicon nanostructuring to be far-reaching, facilitating fundamental studies and targeting applications spanning solar panels, antifogging/antibacterial surfaces, sensing, amongst many others.

Size and Morphology Control of Highly-Ordered Nano-Silicon Pillar Fabricated by Direct Nanosphere Lithography

Fabrication of Submicrometer Inp Pillars by Colloidal Lithography and Dry Etching

Fabrication of large-scale periodic silicon nanopillar arrays for 2D nanomold using modified nanosphere lithography☆

Multiple-Patterning Nanosphere Lithography for Fabricating Periodic Three-Dimensional Hierarchical Nanostructures.

Application of two-dimensional polystyrene arrays in the fabrication of ordered silicon pillars

Fabrication of Ordered Arrays of Silicon Nanopillars at Selected Sites

Fabrication and optical properties of silicon nanopillar arrays with controllable surface structures

Fabrication of ordered arrays of silicon nanopillars in silicon-on-insulator wafers

Fabrication of Silicon Hierarchical Nanopillar Arrays Based on Nanosphere Lithography

FABRICATION OF SILICON NANOARRAYS BY DIRECT NANOSPHERE LITHOGRAPHY

Periodic Silicon Nanocones Arrays with Controllable Dimensions Prepared by Two-Step Etching Using Nanosphere Lithography and NH4OH/H2O2 Solution

Hierarchically Ordered Silicon Metastructures from Improved Self-Assembly-Based Nanosphere Lithography

Controlled thinning and surface smoothening of silicon nanopillars

Wafer Scale Fabrication of Dense and High Aspect Ratio Sub-50 Nm Nanopillars from Phase Separation of Cross-Linkable Polysiloxane/Polystyrene Blend

Fabrication of Nanopillars Based on Silicon Oxide Nanopatterns Synthesized in Oxygen Plasma Removal of Photoresist

Morphology Control and Electron Field Emission Properties of High-Ordered Si Nanoarrays Fabricated by Modified Nanosphere Lithography

A route to engineered high aspect-ratio silicon nanostructures through regenerative secondary mask lithography

Controlled Fabrication of Silicon Nanowires Via Nanosphere Lithograph and Metal Assisted Chemical Etching

High aspect ratio arrays of Si nano-pillars using displacement Talbot lithography and gas-MacEtch

Large Area Fabrication of High Aspect Ratio Nano‐cylinders on Micro‐pillars Based on a Colloidal Crystal Mask

A Simple Pathway to Ordered Silica Nanopattern from Self-Assembling of Block Copolymer Containing Organic Silicon Block