Nitrogen Diffusion in the Si Growth on GaN by Low-Pressure Chemical Vapor Deposition

Chen P.,Zheng Y. D.,Zhu S. M.,Xi D. J.,Zhao Z. M.,Gu S. L.,Han P.,Zhang R.
DOI: https://doi.org/10.1557/jmr.2002.0277
2002-01-01
Abstract:Si film has been grown on a wurtzite gallium nitride layer on sapphire by low-pressure chemical vapor deposition. Uniform nitrogen incorporation was found in the Si film at the concentration of 5%, indicating an incorporation-limited process through interstitial diffusion from GaN layer to Si layer. The nitrogen occupied the substitutional sites in the Si film, leading this Si layer to be n-type doping with the carrier concentration of 1.42 × 1018/cm3 and the hall mobility of 158 cm2/(V s). This is consistent with other calculated and experimental results, which suggest that only 5% nitrogen can occupy the substitutional sites in the nitrogen-doped Si materials.
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