Thermal Nitridation Kinetics of Silicon Wafers in Nitrogen Atmosphere During Annealing

HL Zhu,DR Yang,L Wang,DL Due
DOI: https://doi.org/10.1016/j.tsf.2004.09.006
IF: 2.1
2004-01-01
Thin Solid Films
Abstract:Silicon wafers were annealed in pure and low-purity nitrogen gas at temperatures from 800 to 1200 °C. The surfaces of the annealed samples were investigated by means of X-ray photoelectron spectroscopy and optical microscopy. It was found that silicon wafers could react with nitrogen molecules to form silicon nitride films at temperatures higher than 1100 °C in pure nitrogen atmosphere. The thickness of the silicon nitride films thermally grown in pure nitrogen gas at 1100 and 1200 °C for up to 4 h was measured. The maximum thickness was about 50 nm, and the growth kinetics of direct thermal nitridation at 1100 and 1200 °C was obtained.
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